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Ball grid array type integrated circuit interface adapater

A technology of interface adapter and integrated circuit, which is applied to the components of electrical measuring instruments, instruments, and measuring electrical variables. Good frequency characteristics

Active Publication Date: 2017-05-31
NO 709 RES INST OF CHINA SHIPBUILDING IND CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The measurement of the loading board needs to collect the output signal on the loading board, but because the signal output point on the loading board is a solder hole structure, it is inconvenient to directly contact the probe. In order to ensure the accuracy and stability of the output signal collection, it is necessary to design an integrated circuit Interface adapter as connector between loading board and probe

Method used

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  • Ball grid array type integrated circuit interface adapater
  • Ball grid array type integrated circuit interface adapater
  • Ball grid array type integrated circuit interface adapater

Examples

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Embodiment Construction

[0017] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0018] Such as figure 1 figure 2 As shown, the design of a ball grid array integrated circuit interface adapter in the embodiment of the present invention includes connection design, internal wiring and routing design, fixing design, impedance matching design and other aspects.

[0019] The front of the integrated circuit interface adapter is designed as a certain number of regularly arranged solid pads, and an insulating layer is coated on the periphery of the pads to isolate the signal from the ground signal. The solid pads are connected to the probe using two One ground point surrounds the signal (the signal is in the middle, and two ground points are around), in which the probe is in contact with the solid pad, and the two ground points of the probe are in contact with the copper-clad ground signal on the interface adapter to form a transmission l...

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Abstract

The invention discloses a ball grid array type integrated circuit interface adapater. The ball grid array type integrated circuit interface adapater comprises a PCB (1) with a multilayer structure, a probe bit array, a BGA ball array and location holes (4), wherein the BGA ball array and the probe bit array are consistent in scale; the location holes (4) are formed in the periphery of the PCB (1) and used for fixing the PCB (1) on a loading plate; and the probe bit array is arranged on the front surface of the PCB (1) and is in contact connection with a probe of a test system, and the BGA ball array is arranged on the back surface of the PCB (1) and is in contact connection with a welding hole of the loading plate for a tested integrated circuit. The ball grid array type integrated circuit interface adapater has the characteristics of large number of containable I / O, high encapsulation reliability, strong identity of horizontal planes of pins, good frequency characteristic and the like and is applicable to connection with a loading plate bonding pad.

Description

technical field [0001] The invention relates to the technical field of integrated circuit test fixture measurement, in particular to a ball grid array type integrated circuit interface adapter. Background technique [0002] Integrated circuit (integrated circuit) testing is the process of screening out defective integrated circuit devices. In the semiconductor industry, integrated circuit testing is an indispensable link. In the integrated circuit test process, the integrated circuit test system loading board (hereinafter referred to as the loading board) is used as the connection circuit between the pogo pin of the test channel port of the integrated circuit test system and the pin of the tested integrated circuit, and its transmission performance plays an important role in the test results. The role that cannot be ignored, especially when the test signal transmission rate is higher than 200Mbps, the crosstalk between signal 0 and 1 will increase significantly, and the qual...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/04
CPCG01R1/0433G01R1/0441
Inventor 孙崇钧肖莹
Owner NO 709 RES INST OF CHINA SHIPBUILDING IND CORP
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