Pre-encapsulated wire-less plateable lead frame package structure and manufacturing method thereof

Abstract

The invention relates to a pre-packaged non-conductor platable lead frame packaging structure and a manufacturing method thereof. The structure comprises a metal circuit layer (1), wherein a metal pin layer (2) is arranged on the back face of the metal circuit layer (1); a first molding compound (3) is packaged on the periphery of the metal circuit layer (1) and the metal pin layer (2); a groove (4) is etched on the back face of the metal pin layer (2); a pre-plated copper layer (5) is arranged in the front face of the metal circuit layer (1); a surface treatment electroplated layer (6) is arranged in the front face of the pre-plated copper layer (5); a chip (7) is pasted on the surface treatment electroplated layer (6); a second molding compound (8) is packaged on the periphery of the pre-plated copper layer (5), the surface treatment electroplated layer (6) and the chip (7). The pre-packaged non-conductor platable lead frame packaging structure provided by the invention adopts a whole-surface pre-plated copper material as a base material so as to electroplate an electroplating area required to be processed on the surface of the metal circuit layer, and the redundant pre-plated copper material is etched after electroplating is finished, so that the non-conductor platable structure is realized, and high density, high reliability and an excellent performance of a lead frame are improved.

Description

technical field [0001] The invention relates to a package structure of a prepackaged non-conductive plateable lead frame and a manufacturing method thereof, belonging to the technical field of semiconductor packages. Background technique [0002] The current structure and technology of lead frame products mainly include: [0003] 1. Stamping method: Generally, high-precision strips are punched by high-speed punching machines with a high degree of automation, and many single products with independent functions (such as low-density products such as SOT and SOP) are obtained. The wire and the side rib are connected as a whole, and NiAu, Ag, NiPtAu, etc. are electroplated on the required area of ​​a single product. After the packaging is completed, it is cut into a single piece, and the conductive wire can be punched off. [0004] 2. Etching method: use mask exposure, development, etching and other processes to etch the metal carrier to obtain many single products with independ...

AI Technical Summary

Problems solved by technology

[0006] 1. With the continuous improvement of miniaturization, ultra-thin, and high-density requirements for packaged products, the requirements for the production of lead frames or substrates are also miniaturized, ultra-thin, and high-density. Limited by the wiring of electroplated wires, the wiring capabilities of products cannot Achieve miniaturization, ultra-thin, high density;

[0007] 2. The lead frame can be electroplated with conductive wires, which increases the number of wiring per unit area. The wires will increase the external transmission of high-frequency signals and mutual coupling, increase signal loss, mutual interference and parasitic coupling, and restrict the performance of high-frequency products. ;

[0008] 3. The conductive wire can be used to plate the lead frame. The existence of the conductive wire increases the contact area with the insulating material, which increases the risk of delamination between the copper and the insulating material during subsequent use, resulting in product failure;

[0009] 4. The conductive wire can be used to electroplate the lead frame. After the product is cut, the electroplated conductive wire will be exposed on the side. During the cutting process, the conductive wire and the insulating material are prone to delamination due to mechanical stress, thereby reducing the reliability level of the product. affect the life of the product;

[0010] 5. The lead frame can be electroplated with conductive wires. Due to the increase of copper content, it is easy to cause mismatch between copper and insulating materials, which will affect the warpage of the product and affect the workability of subsequent packaging.

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