Formation process of printed circuit board (PCB)

Abstract

The invention relates to the field of a printed circuit board (PCB), and aims to provide a formation process of the PCB. The formation process of the PCB comprises the following steps of 1, fabricating the PCB according to a shape and a function of a product; 2, processing a hole groove which does not penetrate through the PCB in an upper surface of the PCB, and filling the hole groove with tin; 3, plating copper on a surface of a bottom plate of the PCB; 4, coating exposure oil on a surface of a circuit board, photoprinting a circuit film on the circuit board, performing exposure, and removing exposed ink which is not hardened; and 5, performing secondary drilling at the position of the hole groove in the step 2, and milling an edge surface of a hole after drilling, wherein the depth and the diameter of the secondary drilling is smaller than the depth and the diameter of the hole groove. The formation process has the beneficial effects that the hole groove is filled with a tin material, subsequent drilling is performed on the basis of the tin material, the size is accurate, the welding is firm, and the conductivity is good.

Description

technical field [0001] The invention relates to the field of PCB boards, in particular to a PCB board forming process. Background technique [0002] PCB board processing is already a mature technology in the production of electronic products, but the product quality problems caused by drilling holes in PCB board processing have not been well resolved. Due to the poor material performance of the PCB bottom plate and low processing accuracy, the PCB board The copper foil in the socket is thin and has poor ductility. After drilling, the copper foil is easy to warp, and copper wires are easy to remain in the hole, which leads to problems such as weak solder feet and poor conductivity when the plug-in manufacturer performs soldering. Contents of the invention [0003] The object of the present invention is to overcome the above-mentioned defects, and provide a PCB molding process with firm welding and good electrical conductivity. [0004] In order to solve the problems of the...

AI Technical Summary

Problems solved by technology

[0002] PCB board processing is already a mature technology in the production of electronic products, but the product quality problems caused by drilling holes in PCB board processing have not been well resolved. Due to the poor material performance of the PCB bottom plate and low processing accuracy, the PCB board The copper foil in the socket is thin and has poor ductility. After drilling, the copper foil is easy to warp, and copper wires are likely to remain in the hole, which leads to problems such as weak solder feet and poor conductivity when the plug-in manufacturer solders.