Circuit board packaging structure and manufacturing method thereof
A technology of packaging structure and manufacturing method, which is applied in the manufacture of printed circuits, printed circuits, and assembling printed circuits with electrical components. Yield effect
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[0043] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed descriptions of the embodiments with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as: "upper", "lower", "front", "rear", "left", "right", etc., are only referring to the directions of the attached drawings. Accordingly, the directional terms used are illustrative, not limiting, of the invention. Also, in the following embodiments, the same or similar components will be given the same or similar symbols.
[0044] Figure 1A to Figure 1M is a schematic cross-sectional flow diagram of a manufacturing method of a circuit board packaging structure according to an embodiment of the present invention. Please refer to Figure 1A , The manufacturing method of the circuit board packaging structure of this embodiment includes the following steps. First, provide the Figur...
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