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Array substrate, its repair method, and display device

An array substrate and repair structure technology, applied in the field of liquid crystal display, can solve problems such as unrepairable, disconnected metal data lines, and reduced production yield of array substrates, so as to improve production yield and save production costs

Active Publication Date: 2020-06-23
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the thickness of the second indium tin oxide layer is about The film thickness is relatively thin and exposed on the surface of the array substrate, and there is a step difference between the metal data line and the source / drain. open circuit
Moreover, the via hole connection method of the existing array substrate has no corresponding remedial structure for this, resulting in the failure of repair after this problem occurs, which reduces the production yield of the array substrate

Method used

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  • Array substrate, its repair method, and display device
  • Array substrate, its repair method, and display device
  • Array substrate, its repair method, and display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] An array substrate of the present invention is suitable for all array substrates with metal data lines and source / drain electrodes arranged alternately and connected in the form of via holes.

[0028] Take an array substrate with metal data lines and source / drain electrodes alternately arranged in the wiring area and the pixel area respectively and connected by via holes, for example, figure 1 As shown, a base substrate 1 is included, and the material of the base substrate 1 is glass, and is divided into a lead area and a pixel area. The pixel area of ​​the base substrate 1 is provided with a plurality of thin film transistors, wherein each thin film transistor includes gate (not shown in the figure), source / drain 4 and other structures. The wiring area of ​​the base substrate 1 is provided with a plurality of metal data lines 2 arranged on the same layer as the gates of the thin film transistors, which are respectively used to connect with the source / drain electrodes 4...

Embodiment 2

[0035] The structure of the array substrate of the second embodiment is similar to that of the first embodiment, and the principle is the same as that of the first embodiment, the difference is that:

[0036] There is also a second conductive layer between the two layers where the source / drain electrode and the metal data line are located. The second conductive layer is a pixel electrode, and the layer is located in the pixel area, and its material is indium tin oxide. Specifically, the second conductive layer is disposed between the first insulating layer and the two layers where the source / drain is located, so that the second obtaining layer is conductively connected to the source / drain and is insulated from the gate. At this time, one end of the repair structure is conductively connected to the source / drain, and the other end is insulated and overlapped with all or part of the metal data line. This structure can be applied to array substrates such as ADS mode and HADS mode,...

Embodiment 3

[0043] The method for repairing the array substrate of the present invention can be applied to any one of the array substrates in Embodiment 1 or Embodiment 2. The specific method is: when the first conductive layer connecting the metal data line and the source / drain is disconnected, laser Welding conducts conductive connection between the repaired structure and the metal data line or the source / drain that overlaps with it insulated, so that the metal data line and the source / drain form a path through the repaired structure.

[0044] Therefore, in the repair method of the present invention, electrostatic discharge occurs in the production process, and when an open circuit occurs between the metal data line and the source / drain, the repair structure is used to repair the metal data line, the source / drain Vias are formed between them, so that the array substrate can be repaired, and the production yield of the array substrate is improved.

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Abstract

The invention discloses an array substrate, a repair method thereof, and a display device. The array substrate of the present invention includes: a substrate substrate, which is divided into a lead area and a pixel area, the pixel area includes a plurality of thin film transistors, and the lead area includes a plurality of metal data lines arranged in the same layer as the gate electrodes of the thin film transistors; The first conductive layer covers the metal data lines and the source / drain electrodes of the thin film transistor, and conductively connects the metal data lines and the source / drain electrodes one by one through via holes, as well as the repair structure, The repair structure is made of conductive material. One end of the repair structure is conductively connected to any one of the metal data line or the source / drain electrode, and the other end is insulated and overlapped with all or part of the other one of the metal data line or the source / drain electrode. The array substrate, its repair method and the display device of the present invention can be repaired when the metal data lines and source / drain electrodes are disconnected, which can improve the production yield and save production costs.

Description

technical field [0001] The invention relates to the technical field of liquid crystal display, in particular to an array substrate, a repair method thereof, and a display device. Background technique [0002] Liquid crystal display devices with high resolution and high pixel density have become the mainstream of the current liquid crystal display industry. [0003] Under the design requirements of high-resolution liquid crystal display devices, the structural space of the peripheral circuits of the array substrate is often limited, especially for small-sized liquid crystal display devices, the structural space of the peripheral circuits is even more limited. Therefore, the wiring method of the lead area of ​​the peripheral circuit of the array substrate can only adopt the method of alternately wiring the metal data line and the source / drain to meet the process requirements, so that the metal data line and the source / drain can only pass connected by holes. [0004] The exis...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/1362
CPCG02F1/136259H01L27/124G02F1/136263
Inventor 刘萌唐硕孙鹏封宾
Owner BOE TECH GRP CO LTD