Re-processing method of leaking and drilling back board

Abstract

The invention discloses a re-processing method of a leaking and drilling back board. The method comprises the following steps of drilling the back board of a PCB (printed circuit board) to obtain a back board; performing inspection to discover the back board drilling missing; compiling the back drilling supplementation program data by aiming at the corresponding drilling missing back drilling hole; setting the drilling depth; measuring the drilling cuter length and the detector length; performing synchronous correction on the drilling cuter length and the detector length; automatically compensating the difference value A of the drilling cuter length and the detector length after the drilling cutter length and the detector length are corrected; obtaining the height H of a table top of a machine table in contact with a detector through the independent work and descending of the detector to contact the table top of a machine table; resetting the detector; descending a drilling cutter at the uniform speed to reach the height H0, wherein the calculation mode of the H0 is shown as a formula that H0=H-A-B; the H0 is the height during the equipment processing; the H is the height of the table top of the machine table in contact with the machine table; the A is the difference value of the drilling cuter and the detector; the B is the drilling depth set by the back board; performing cutter withdrawal and resetting on the drilling cutter to complete the back board drilling missing complementary drilling. The re-processing of the drilling missing back drilling hole show very high depth control precision and product qualification rate.

Description

technical field [0001] The invention relates to the technical field of PCB back-drilling, in particular to a method for reprocessing a missing drill backboard. Background technique [0002] With the development of high-frequency and high-speed communication products, higher requirements are put forward for loss control in the process of signal transmission. If there is a section of copper in the metallized hole in the printed circuit board (PCB) that is not used for signal transmission (that is, a useless stub, Stub), it will increase the signal transmission loss in the PCB, and even destroy the integrity of the signal transmission. Therefore, the industry often adopts traditional PCB circuit back drilling processing technology (such as figure 1 Shown) reduce the length of the stub as much as possible, and back drill the PCB board to form the back board. Its main principle is to detect the depth through the mechanical drill needle on the BH (Blind hole function) mechanical...

AI Technical Summary

Problems solved by technology

[0003] During the production process, due to factors such as employee misoperation, open circuit of the PCB board circuit, and loss of the mechanical drilling machine, the back drilling will be missed. If the drilling is not repaired, the product will be defective.

Especially after the outer circuit is etched, the conductive circuit cannot be directly formed on the PCB surface, so it is generally necessary to use the electric shock circuit processing technology of the aluminum plate for re-drilling (such as figure 2 As shown), but due to the fact that the printed circuit board has completed the circuit production, there are "concave-convex" unevenness and the influence of uneven thickness and deformation of the aluminum plate, resulting in low detection accuracy of the electric shock circuit and poor drilling quality.

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