Re-processing method of leaking and drilling back board

A heavy processing and backplane technology, which is applied in the direction of electrical components, printed circuit manufacturing, printed circuit, etc., can solve the problems of unsatisfactory drilling quality, uneven thickness of aluminum plate, and low detection accuracy of electric shock circuit, so as to improve enterprise economy Benefits, high control depth accuracy and the effect of product yield

Pending Publication Date: 2017-06-13
SHANTOU ULTRASONIC PRINTED BOARD NO 2 FACTORY +1
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] During the production process, due to factors such as employee misoperation, open circuit of the PCB board circuit, and loss of the mechanical drilling machine, the back drilling will be missed. If the drilling is not repaired, the product will be defective.
Especially after the outer circuit is etched, the conductive circuit cannot be directly formed on the PCB surface, so it is generally necessary to us

Method used

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  • Re-processing method of leaking and drilling back board
  • Re-processing method of leaking and drilling back board
  • Re-processing method of leaking and drilling back board

Examples

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Embodiment 1

[0025] see image 3 , in the embodiment of the present invention, a method for reprocessing the missing drilling backboard, after the back drilling process of the PCB board, especially after the outer layer pattern is etched, the contact conductive circuit technology is no longer used to control the deep drilling process, but Using height difference compensation and direct contact measurement technology to carry out high-precision control depth supplementary drilling to make the back drilling of missed drilling. The specific steps are as follows.

[0026] Step 1: After the outer layer AOI test, or E-Test test, or after the outer layer pattern etching, the manual inspection of the back plate found missing drilling, and compiled the back drilling program data and set the drilling depth for the corresponding missing back drilling holes;

[0027] Step 2: By measuring the length of the drill bit 2 and the length of the optical ruler sensor detector 11, and synchronously correcting...

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Abstract

The invention discloses a re-processing method of a leaking and drilling back board. The method comprises the following steps of drilling the back board of a PCB (printed circuit board) to obtain a back board; performing inspection to discover the back board drilling missing; compiling the back drilling supplementation program data by aiming at the corresponding drilling missing back drilling hole; setting the drilling depth; measuring the drilling cuter length and the detector length; performing synchronous correction on the drilling cuter length and the detector length; automatically compensating the difference value A of the drilling cuter length and the detector length after the drilling cutter length and the detector length are corrected; obtaining the height H of a table top of a machine table in contact with a detector through the independent work and descending of the detector to contact the table top of a machine table; resetting the detector; descending a drilling cutter at the uniform speed to reach the height H0, wherein the calculation mode of the H0 is shown as a formula that H0=H-A-B; the H0 is the height during the equipment processing; the H is the height of the table top of the machine table in contact with the machine table; the A is the difference value of the drilling cuter and the detector; the B is the drilling depth set by the back board; performing cutter withdrawal and resetting on the drilling cutter to complete the back board drilling missing complementary drilling. The re-processing of the drilling missing back drilling hole show very high depth control precision and product qualification rate.

Description

technical field [0001] The invention relates to the technical field of PCB back-drilling, in particular to a method for reprocessing a missing drill backboard. Background technique [0002] With the development of high-frequency and high-speed communication products, higher requirements are put forward for loss control in the process of signal transmission. If there is a section of copper in the metallized hole in the printed circuit board (PCB) that is not used for signal transmission (that is, a useless stub, Stub), it will increase the signal transmission loss in the PCB, and even destroy the integrity of the signal transmission. Therefore, the industry often adopts traditional PCB circuit back drilling processing technology (such as figure 1 Shown) reduce the length of the stub as much as possible, and back drill the PCB board to form the back board. Its main principle is to detect the depth through the mechanical drill needle on the BH (Blind hole function) mechanical...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/0047H05K2203/163
Inventor 袁欢欣蔡锦松郭一彬何润宏
Owner SHANTOU ULTRASONIC PRINTED BOARD NO 2 FACTORY
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