Chemical mechanical polishing apparatus and method thereof
A chemical machinery, polishing device technology, applied in grinding devices, grinding machine tools, metal processing equipment, etc., can solve problems such as pressure deviation, inability to implement and spread out as expected
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0129] Hereinafter, the chemical mechanical polishing apparatus 1 according to an embodiment of the present invention will be described in detail with reference to the drawings. However, in the description of the present invention, the same or similar reference numerals are assigned to well-known functions or configurations, and descriptions related thereto are omitted to clarify the gist of the present invention.
[0130] Such as Figure 4a and Figure 4b As shown, the chemical mechanical polishing device 1 according to an embodiment of the present invention includes: a polishing plate 10, the polishing plate 10 is rotated 11r with a polishing pad 11 on its upper surface; a polishing head 20 to form The process surface of the polishing layer with the wafer W is closely attached to the contact state of the polishing pad 11, and rotates 20r while applying pressure; the regulator 100 is used to modify the surface of the polishing pad 11; the slurry supply part 40 , Used to supply s...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap