High-concentration cerium oxide polishing solution and preparation method thereof

Abstract

The invention relates to a high-concentration cerium oxide polishing solution and a preparation method thereof. The polishing solution is a water suspension and is prepared from the following components in percentage by mass: 40 to 60 percent of cerium oxide, 0.02 to 0.5 percent of dispersant, 0.5 to 5 percent of stabilizer, 0.06 to 1 percent of thickener, 0.1 to 2 percent of chelating agent, 0.25 to 5 percent of lubricant, 0.05 to 0.5 percent of bactericide, an organic alkali regulator and the balance of deionized water. As a xanthan gum and a CMC (sodium carboxymethylcellulose) are compounded to form the thickener, cerium oxide particles can be suspended in the polishing solution for a long time; and as a silica sol is taken as the stabilizer, aggregation of the cerium oxide particles can be reduced through interaction between the silica sol and the cerium oxide, the cerium oxide particles do not harden at the bottom of the polishing solution, and redispersibility of the cerium oxide particles is enhanced. The polishing composition is suitable for polishing a liquid crystal glass substrate, a mobile phone cover plate glass, an optical glass element and the like. The polishing solution has the advantages of high cutting force, good surface quality and easiness in cleaning after polishing.

Description

technical field [0001] The invention belongs to the technical field of materials, and in particular relates to a high-concentration cerium oxide polishing liquid and a preparation method thereof. Background technique [0002] my country is rich in rare earth resources, and the reserves of industrial cerium resources are as high as about 18 million tons, and cerium oxide polishing materials are used in many aspects due to their strong cutting ability, short polishing time, high polishing accuracy, and clean operating environment. The polishing of lenses, optical fibers, optical components, silicon wafers, ITO glass, mobile phone glass, aviation glass, integrated circuit substrates, etc., has become one of the important materials for chemical mechanical polishing. [0003] At present, almost all the polishing liquids used in the production of integrated circuits in my country are imported, and there are few domestic products. However, the imported polishing liquids are expensiv...

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a high-concentration cerium oxide polishing solution to solve the deficiencies in the prior art, such as poor suspension and redispersibility, low removal rate, poor surface quality, and serious environmental pollution.

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