A mass thickness of 400 ~ 2000μg/cm 2 Preparation process of self-supporting ir target
A technology of mass thickness and preparation process, which is applied in the field of nuclear technology applications, can solve the problems of target film curling, inapplicability, poor flatness, etc., and achieve the effect of good thickness uniformity
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Embodiment 1
[0023] A mass thickness of 400 ~ 2000μg / cm 2 The preparation process of the self-supporting Ir target mainly includes the following five steps:
[0024] (1) Take copper foil with a thickness of 15 μm as the substrate, and use the focused heavy ion sputtering method to deposit a mass thickness of 250 μg / cm on the substrate by sputtering 2 The Ir deposition layer obtained copper-based Ir film;
[0025] (2) Place the copper-based Ir film obtained in step (1) on the surface of the nitric acid solution, wherein the copper-based surface directly contacts the nitric acid solution, and after the copper-based is completely corroded and dissolved by nitric acid, the Ir film separated from the copper-based in step (1) is obtained. Deposit layer; the mass fraction of the nitric acid is 50%.
[0026] (3) transfer the Ir deposition layer obtained in step (2) to the surface of deionized water using a glass slide to clean the nitric acid solution on the surface of the Ir deposition layer; ...
Embodiment 2
[0032] The difference from Example 1 is that the thickness of the copper foil in step (1) is 20 μm, and the thickness of the Ir deposition layer is 100 μg / cm 2 .
Embodiment 3
[0034] Unlike Example 1, the thickness of the Ir deposition layer in step (1) is 180 μg / cm 2 .
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