Multi-chip parallel series UVLED array support

An array type, multi-chip technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of insignificant temperature rise of LEDs, uniformity of light emission, deterioration of consistency, and decrease in brightness.

Inactive Publication Date: 2017-06-27
GUILIN UNIV OF ELECTRONIC TECH
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  • Abstract
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Problems solved by technology

Therefore, UVLED has a wide range of applications, such as air, food surface, water, and medical sterilization. Using the sterilization function of deep ultraviolet rays, it can effectively sterilize and block the spread of viruses; it can also be used to make mosquito killer lamps; but according to UVLED thermal Characteristics, under low current, the temperature rise of LED is not obvious. If the ambient temperature is high, the dominant wavelength of UVLED will be red-shifted, the brightness will decrease, and the uniformity and consistency of light emission will become worse, especially the temperature rise of dot matrix and large display screens. It has a more significant impact on the reliability and stability of LEDs, so heat dissipation design is very critical. For high-power UVLED packaging, heat dissipation and light output are mainly considered

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  • Multi-chip parallel series UVLED array support

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[0019] A multi-chip parallel-series UVLED array support, the support has a stacked structure, including sequentially stacked heat dissipation layer 5, first insulating layer 4, circuit layer 3, second insulating layer 2 and single-sided mirror emission layer 1 , The reflective cups 7 are evenly distributed on the single-sided specular emission layer 1, and the chip pads are arranged in the intervals of the reflective cups.

[0020] The material of the single-sided specular emission layer 1 is light aluminum and ALC aluminum, and the material of the support substrate is light aluminum and ALC aluminum base. For light aluminum, it has light, soft and good electrical conductivity, heat conduction, and high reflection performance. In addition , also has strong corrosion resistance and certain insulation, and the ALC aluminum base has the advantages of comprehensive insulation, which can solve the heat conduction problem of LED chips. The aluminum material model in this example is 1...

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Abstract

The invention discloses a multi-chip parallel series UVLED array support. The support is in the form of a laminated structure comprising a heat radiation layer, a first insulating layer, a circuit layer, a second insulating layer, and a single-sided mirror emitting layer which are stacked in sequence. The single-sided mirror emitting layer is provided with uniformly distributed reflector cups, and chip pads are provided in the intervals of the reflector cups. The LED light source packaged by the support is featured by reasonable and compact design, high temperature, oxidation resistance, corrosion resistance, high reflectivity, good insulation properties, high thermal conductivity, high condensing efficiency, and good heat dissipation.

Description

technical field [0001] The invention relates to an industrial ultraviolet lamp curing technology, in particular to a multi-chip and serial UVLED array bracket. Background technique [0002] The development history of LED has been several decades. With the rapid development of LED technology, the luminous efficiency of LED is gradually improved and the cost is gradually reduced, which makes the application market of LED will be more extensive. In the field of white light lighting, as a carrier bracket for LED chips, it has undergone the evolution and evolution of polyphthalamide materials, PLCC packaging, and ceramic materials in terms of structure and materials. [0003] The thermoplastic used in the field of LED brackets is mainly polyphthalamide. Polyphthalamide plastics have high initial whiteness, strong temperature and humidity resistance, and are suitable for injection molding processes. Therefore, in the LED field In addition, polyphthalamide stents have low price an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/60H01L33/64
CPCH01L33/483H01L33/60H01L33/641H01L33/647
Inventor 莫祖贰庞贤明
Owner GUILIN UNIV OF ELECTRONIC TECH
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