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PCB (Printed Circuit Board) layer layout method and system

A technology of PCB board and layout method, applied in the field of PCB board layer layout method system, can solve the problems of prolonging the design cycle, increasing labor costs, affecting the overall design progress of the project, etc.

Inactive Publication Date: 2017-07-07
北京浩瀚深度信息技术股份有限公司
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  • Summary
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Generally, PCB design cycle requirements are relatively urgent. If you operate according to the existing conventional Mirror function method at this time, wiring, vias, copper pouring, etc. need to be redesigned, which will prolong the design cycle, increase labor costs, and affect the overall design progress of the project.
[0005] In summary, there are obviously inconveniences and defects in the actual use of the existing technology, so it is necessary to improve

Method used

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  • PCB (Printed Circuit Board) layer layout method and system
  • PCB (Printed Circuit Board) layer layout method and system
  • PCB (Printed Circuit Board) layer layout method and system

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Embodiment Construction

[0040] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0041] The technical method involves inversion of element layout and wiring levels due to designer's negligence when using Cadence allegro design software for pcb layout and wiring. At this time, if the design is modified according to the conventional method, a lot of time and energy will be wasted. For this reason, a skillful method for quickly switching the layout and wiring of the top and bottom layers (or local unit circuit modules) is proposed.

[0042] see figure 1 , the present invention provides a PCB board layer layout system, which includes an information acquisition module 10, a buildin...

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Abstract

The invention is suitable for the technical field of PCB arrangement, and provides a PCB (Printed Circuit Board) layer layout method. The method comprises the following steps that: according to schematic diagram network attributes, obtaining each piece of component information; in a preset environment, constructing a multiplexing unit circuit module; responding to a calling command, and moving the unit circuit module of a current board layer to a target board layer. The invention also correspondingly provides a PCB layer layout system for realizing the above method. Therefore, through a secondary multiplexing skill, the comprehensive transformation of all elements for top and bottom level component layout wiring can be quickly realized, working efficiency is improved, labor cost is saved, and the delay of a project cycle is avoided.

Description

technical field [0001] The invention relates to the technical field of PCB layout, in particular to a PCB layer layout method system. Background technique [0002] PCB (Printed Circuit Board) design refers to the design of printed circuit boards, and layout and wiring are the most important tasks in printed circuit board design. Now that we have entered the information age, electronic products are showing a trend of high performance, high speed, high density and thinness. PCB design has become one of the most critical technologies for electronic equipment. [0003] In the usual PCB drawing process, from time to time, due to the negligence of the designer, he did not pay attention to the design requirements, and the large BGA chips, power modules, large inductors and capacitors were all placed on one level during layout, such as those that should have been placed on the bottom layer. It was placed on the top floor; or due to not paying attention to the height limit requireme...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F30/392
Inventor 陶文华
Owner 北京浩瀚深度信息技术股份有限公司
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