Protective film covering method

Abstract

Provided is a protective film covering method, which easily removes liquid resin on the upper surface of an annular frame that carries a wafer through a protective tape. According to the protective film covering method, water-soluble resin is utilized to cover the front side of the wafer with a protective film. Multiple devices are formed on the front side of the wafer. The protective film covering method includes a water-soluble resin removing step that removes the water-soluble resin scattered onto the upper surface of the annular frame in a protective film covering step. In the water-soluble resin removing step, a spinner table is made to rotate while a cleaning nozzle is positioned on the upper surface of the annular frame held on the spinner table to provide cleaning water for the upper surface of the frame, an air nozzle and the water nozzle are positioned on the downstream side in the rotational direction in an adjacent manner, and air is provided against the flow of the water on the upper surface of the annular frame so that the cleaning water temporarily stays and is then expelled outward of the annular frame.

Description

technical field [0001] The present invention relates to a protective film covering method for covering the front surface of a wafer such as a semiconductor wafer with a protective film. Background technique [0002] As known to those skilled in the art, in the manufacturing process of semiconductor devices, a plurality of regions are divided by dividing lines arranged in a grid on the front surface of a semiconductor substrate such as silicon, and ICs are formed in the divided regions. , LSI and other devices. The semiconductor wafer thus formed is cut along planned dividing lines to manufacture individual device chips. In addition, in an optical device wafer, a plurality of regions are divided by dividing lines formed in a grid pattern on the front surface of a sapphire substrate or the like, and gallium nitride-based compound semiconductors and the like are stacked in the divided regions and optical components are formed. Devices, the optical device wafer is divided into...

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that, when transferring the wafer supported by the ring-shaped frame via the protective tape, the liquid resin adhering to the upper surface of the ring-shaped frame acts like an adhesive to make the ring-shaped frame Cannot be detached from the transport unit

[0009] And, although it has also been proposed that after the protective film is covered on the front surface of the wafer by the protective film covering unit, cleaning water is provided to the water-soluble resin dispersed on the upper surface of the ring-shaped frame to remove the water-soluble resin from the ring-shaped frame. However, there are the following problems: it takes considerable time to reliably remove the water-soluble resin attached to the upper surface of the ring-shaped frame, and smooth laser processing cannot be performed.

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