Miniature feedback cavity sensor and its manufacturing method

A sensor and miniature technology, which is applied in the direction of electrostatic transducer microphone, loudspeaker, electrical components, etc., can solve the problems of mass production that cannot be manufactured, the bulky size of miniature microphones, and not suitable for chip integration, etc., to achieve increased volume, Effects of downsizing and cost reduction

Inactive Publication Date: 2019-11-15
李美燕
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, special attention must be paid to the fact that the space in the back cavity must be completely sealed (only the connection to the outside world is reserved through the diaphragm); if the back cavity is not properly sealed and connected to the front cavity space, the frequency response curve will be in the Sensitivity reduction occurs in the low frequency range
In the known technology, a package lid (package lid) is usually used to cover the MEMS chip to provide a huge back cavity. However, this packaging method is not suitable for the integration of the chip, and the volume of the miniature microphone produced is also large. Quite bulky and cannot be mass-produced with wafer-level manufacturing

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Miniature feedback cavity sensor and its manufacturing method
  • Miniature feedback cavity sensor and its manufacturing method
  • Miniature feedback cavity sensor and its manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0047] The miniature feedback cavity sensor with feedback cavity design in the embodiment of the present invention can be used as an acoustic wave sensor (such as a microphone), an ultrasonic sensor, or can be used as a pressure sensor, or can have functions such as a microphone and a pressure sensor at the same time , to achieve the effect of sensor integration. Of course, it is not limited to this, and other types of sensors that can improve the quality of the sensor through the design of the feedback cavity, such as thermal-type (thermal-type), mobile (motion-type) and other sensors can also be applied to the present invention structure and manufacturing process. In addition, the present invention utilizes wafer-level manufacturing technology, which enables mass production and reduces costs. Furthermore, the present invention completely abandons the traditional packaging method to manufacture the volume of the working cavity (back cavity), and fully utilizes the wafer-leve...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A micro feedback-chamber sensor comprises: a semiconductor base having a sensing circuit; a bonding structure layer disposed on the semiconductor base; and a sensing member chip having a low-resistance semiconductor body, a first end portion and a second end portion. The semiconductor body has free-standing Si posts, the first end portion is formed with a sensing member structure, the second end portion is connected to the semiconductor base through the bonding structure layer, and a micro feedback-chamber structure is formed between the sensing member structure, the semiconductor base and the semiconductor body. The sensing member structure is electrically connected to the sensing circuit through the free-standing Si posts. The sensing member structure and the micro feedback-chamber structure collaboratively react to an externally inputted physical signal to generate a sensing signal outputted to the sensing circuit. A method of manufacturing the micro feedback-chamber sensor is also provided.

Description

technical field [0001] The invention relates to a miniature feedback cavity sensor and a manufacturing method thereof, in particular to a miniature feedback cavity sensor for sound waves and / or pressure and a manufacturing method thereof. Background technique [0002] Piezoelectric, piezoresistive and capacitive are currently common micro sensor technologies. Piezoelectric sensors use the characteristics of piezoelectric materials to output current or voltage after being disturbed by external forces, and convert input physical signals into electrical signals, while piezoresistive sensors use piezoresistive materials to change the resistance characteristics after being stressed. One of the most common sensing methods is capacitive sensing, which has excellent characteristics such as easy manufacturing, high sensitivity, and low power consumption, and is currently the mainstream of market development. [0003] In particular, a sensor with a feedback cavity design, such as a m...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H04R19/04
CPCH04R19/04H04R2400/11
Inventor 范成至
Owner 李美燕
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap