Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Uncovering method of soft-hard combined plate

A technology of flexible and rigid boards and hard boards, which is applied to the removal of conductive materials by chemical/electrolytic methods, multi-layer circuit manufacturing, and electrical components. Problems such as the inability to manually peel off the cover plate can achieve the effect of improving the factory's process capability and production efficiency

Inactive Publication Date: 2017-07-21
GULTECH WUXI ELECTRONICS CO LTD
View PDF3 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the thinner and higher density of market products, this method has the problem that the smaller flexible board width cannot be manually peeled off the cover
[0003] The method of opening the cover after UV laser cutting is to manually peel off the protective layer remaining on the surface of the soft board, so as to expose the area of ​​the soft board required by the customer and achieve the effect of the finished product. If there is an FPCB with a small width of the soft board (ie Rigid-flex printed circuit board), due to the narrow area of ​​the flexible board, the cover is very easy to break and remain on the soft board when it is manually peeled off, this method will affect the production time and product quality

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Uncovering method of soft-hard combined plate
  • Uncovering method of soft-hard combined plate
  • Uncovering method of soft-hard combined plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A method for uncovering a rigid-flex board includes the following steps:

[0022] a. Take the prefabricated rigid-flex board, which includes a soft-board substrate 1, a first soft-board copper foil 2.1, a second soft-board copper foil 2.2, a first cover film 3.1, and a second cover film 3.2, the first basic prepreg 4.1, the second basic prepreg 4.2, the first basic hard board copper foil 5.1, the second basic hard board copper foil 5.2, the first additional prepreg 6.1, the second additional prepreg 6.2, the first additional hard board copper Foil 7.1 and the second additional hard board copper foil 7.2, the number of the first additional hard board copper foil 7.1 and the second additional hard board copper foil 7.2 are the same, a first window is opened on the first base prepreg 4.1, and the second base There is a second window on the prepreg 4.2, and the position of the first window corresponds to the second window; the first flexible board copper foil 2.1 is connect...

Embodiment 2

[0027] A method for uncovering a rigid-flex board includes the following steps:

[0028] a. Take the prefabricated rigid-flex board, which includes a soft-board substrate 1, a first soft-board copper foil 2.1, a second soft-board copper foil 2.2, a first cover film 3.1, and a second cover film 3.2, the first basic prepreg 4.1, the second basic prepreg 4.2, the first basic hard board copper foil 5.1, the second basic hard board copper foil 5.2, the first additional prepreg 6.1, the second additional prepreg 6.2, the first additional hard board copper Foil 7.1 and the second additional hard board copper foil 7.2, the number of the first additional hard board copper foil 7.1 and the second additional hard board copper foil 7.2 are the same, a first window is opened on the first base prepreg 4.1, and the second base There is a second window on the prepreg 4.2, and the position of the first window corresponds to the second window; the first flexible board copper foil 2.1 is connect...

Embodiment 3

[0034] A method for uncovering a rigid-flex board includes the following steps:

[0035]a. Take the prefabricated rigid-flex board, which includes a soft-board substrate 1, a first soft-board copper foil 2.1, a second soft-board copper foil 2.2, a first cover film 3.1, and a second cover film 3.2, the first basic prepreg 4.1, the second basic prepreg 4.2, the first basic hard board copper foil 5.1, the second basic hard board copper foil 5.2, the first additional prepreg 6.1, the second additional prepreg 6.2, the first additional hard board copper Foil 7.1 and the second additional hard board copper foil 7.2, the number of the first additional hard board copper foil 7.1 and the second additional hard board copper foil 7.2 are the same, a first window is opened on the first base prepreg 4.1, and the second base There is a second window on the prepreg 4.2, and the position of the first window corresponds to the second window; the first flexible board copper foil 2.1 is connecte...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to an uncovering method of a soft-hard combined plate. The method comprises following steps of successively etching and removing first additional hard plate copper foils in a first window range correspondingly from up to down, and successively etching and removing second additional hard plate copper foils in a second window range correspondingly from up to down; successively burning first additional prepregs in the first window range from up to down through a CO2 laser machine, and successively burning second additional prepregs in the second window range from up to down through the CO2 laser machine; and etching and removing first basic hard plate copper foils in the first window range correspondingly and etching and removing second basic hard plate copper foils in the second window range correspondingly. According to the invention, abnormal conditions that a cover is easily damaged when being uncovered, and residual cover plates are left on the surface of a soft plate layer in case of a quite small cover plate region are avoided; and production quality and production efficiency of products are improved.

Description

technical field [0001] The invention relates to a method for uncovering a rigid-flex board, and the invention belongs to the technical field of production methods of printed circuit boards. Background technique [0002] In line with the current principles of thinning, light weight and miniaturization of products, customers now have higher and higher requirements for printed circuit boards. In order to reduce the connector between soft boards and hard boards and further optimize the soft-hard board, now the soft-hard board The length of the flexible board is getting smaller and smaller. At this stage, the industry FPCB (that is, the soft-hard printed circuit board) is opened after the production. The upper cover is manually peeled off. Due to the thinner and higher density of market products, this method has the problem that the smaller flexible board width cannot be manually peeled off the cover. [0003] The method of opening the cover after UV laser cutting is to manuall...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K3/06H05K3/00
CPCH05K3/4691H05K3/0026H05K3/06H05K2203/107
Inventor 闫诚鑫
Owner GULTECH WUXI ELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com