A process for suppressing deformation of green ceramics during the processing of multilayer ceramic circuits

A multi-layer ceramic and circuit processing technology, which is applied in the manufacturing of circuits, electrical components, semiconductor/solid-state devices, etc., can solve the problems of reducing the effective utilization rate of green ceramics, reducing production efficiency, and increasing costs, and is conducive to the whole process of automatic production. , High-level alignment accuracy, the effect of improving production efficiency

Active Publication Date: 2019-01-01
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since green porcelain is mostly made by casting, there will be residual stress between the green porcelain and the film tape (Mylar film) that supports it. After punching, hole filling, printing, stripping (removing Mylar film) and other processes, there will often be large deformations, and this deformation has the characteristics of random distribution in the area and different deformations in each layer, resulting in poor alignment accuracy between layers, especially for components / substrates. Performance is adversely affected, product performance deviates, and yield is low
[0003] The method adopted in the prior art is to bond each layer of green porcelain on a metal hard frame, and limit the deformation of the green porcelain by a fixed method, but this method needs to configure a metal frame for each piece of green porcelain, resulting in The huge burden of transfer and storage of semi-finished products in the process, and the area required for pasting the frame also reduces the effective utilization of green porcelain, resulting in reduced production efficiency and increased costs

Method used

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  • A process for suppressing deformation of green ceramics during the processing of multilayer ceramic circuits
  • A process for suppressing deformation of green ceramics during the processing of multilayer ceramic circuits
  • A process for suppressing deformation of green ceramics during the processing of multilayer ceramic circuits

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Embodiment 1

[0022] The following are the method steps for suppressing the deformation of green ceramics in the process of multi-layer ceramic circuit processing, please refer to Figure 1-4 :

[0023] 1) After the green porcelain is cut to the standard process size, tear off the Mylar film 2 of the green porcelain from the green porcelain 1, such as figure 1 shown.

[0024] 2) Dry the green porcelain 1 without film at a temperature of 60°C for 30 minutes to obtain the green porcelain 3 deformed in place, such as figure 2 shown.

[0025] 3) Paste the organic diaphragm 4 coated with 1 μm low-viscosity coating on one side on the deformed green porcelain 3, such as image 3 shown. The thickness of the organic membrane 4 is 50 μm.

[0026] 4) The green porcelain after the second filming is as Figure 4 As shown, the green ceramics 3 and the organic film 4 are well bonded, and the green ceramics can be kept low in deformation during the processing of the multi-layer co-fired ceramic circ...

Embodiment 2

[0030] The following are the method steps for suppressing the deformation of green ceramics in the process of multi-layer ceramic circuit processing, please refer to Figure 1-4 :

[0031] 1) After the green porcelain is cut to the standard process size, tear off the Mylar film 2 of the green porcelain from the green porcelain 1, such as figure 1 shown.

[0032] 2) For green porcelain 1 without film, place it naturally for 8 hours in a 100,000-level purification environment to obtain green porcelain 3 deformed in place, such as figure 2 shown.

[0033] 3) Paste the organic diaphragm 4 coated with 2.5μm low-viscosity coating on one side on the deformed green porcelain 3, such as image 3 shown. The thickness of the organic membrane 4 is 75 μm.

[0034] 4) The green porcelain after the second filming is as Figure 4 As shown, the green ceramics 3 and the organic film 4 are well bonded, and the green ceramics can be kept low in deformation during the processing of the mult...

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Abstract

The invention discloses a technological method capable of suppressing raw ceramic deformation in processing of a multilayered ceramic circuit. The technological method comprises the following steps of performing film removing and aging on raw ceramic, and then performing secondary film pasting on the aged raw ceramic, and next, processing by adopting a conventional multilayered ceramic circuit process with the steps of punching holes, filling holes, printing, removing film, laminating, pressing, sintering, separating sheets, and testing / detecting. According to the method, the raw ceramic is subjected to film removing and aging, so that residual stress from curtain coating is removed, and the raw ceramic can be deformed properly; then the aged raw ceramic is subjected to secondary film pasting and then subsequent processing; the deformation rate of the raw ceramic is reduced from higher than 0.06% in the convention way to be less than 0.03%, so that the problem of poor lamination alignment precision of the multilayered ceramic circuits can be effectively solved; and compared with the prior art, the technological method is simple in operation and low in manufacturing cost.

Description

technical field [0001] The invention belongs to the field of ceramic circuit manufacturing, and in particular relates to a process method for suppressing deformation of green ceramics during the processing of multilayer ceramic circuits. Background technique [0002] The conventional manufacturing process of multilayer co-fired ceramic circuit substrate is: 1) According to the design pattern, make conductor patterns, conductor through holes, cavities, etc. on each layer of green ceramics, 2) Make conductor patterns, conductor through holes and The green ceramics in the cavity are stacked in sequence, and then pressed into dense green ceramic blocks by heating and pressing. Multilayer co-fired ceramic circuit substrate. Since most of the green ceramics are made by casting, there will be residual stress between the green ceramics and the film tape (Mylar film) supporting it. Large deformation often occurs after processes such as film), and this deformation has the characteri...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48
CPCH01L21/4807
Inventor 岳帅旗刘志辉张刚王娜
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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