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A kind of flake-containing graphite heat-conducting filler and its preparation method and application

A technology of flake graphite and thermally conductive filler, which is applied in heat exchange materials, chemical instruments and methods, etc., can solve problems such as poor mechanical properties and difficult processing, and achieve the effect of improving production efficiency, broadening application scope and ensuring mechanical properties.

Active Publication Date: 2019-04-05
BENSONG ENG PLASTICS HANGZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In addition, the thermal conductivity of composite materials depends on the content of thermally conductive fillers, and when the filling content is too high (more than 50%), it will inevitably bring problems such as processing difficulties (such as broken bars) and poor mechanical properties. Thermally conductive composite materials are not suitable in some fields that have high requirements for thermal conductivity and mechanical properties

Method used

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  • A kind of flake-containing graphite heat-conducting filler and its preparation method and application
  • A kind of flake-containing graphite heat-conducting filler and its preparation method and application
  • A kind of flake-containing graphite heat-conducting filler and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Preparation of graphite thermally conductive filler: Weigh 6 parts by weight of flake graphite powder with a D50 particle size of 8.56 μm and 24 parts by weight of non-flaky graphite powder with a D50 particle size of 175 μm, and mix them at a high speed at a temperature of 80 ° C to obtain a graphite mixture; Take 5 parts by weight of low-viscosity bisphenol A liquid epoxy resin and put it into a planetary power mixer, raise the temperature to 100°C, and slowly put the graphite mixture into the planetary power mixer in 3 times under stirring, and stir to make Add 2 parts by weight of tetrakis (2-hydroxyethyl) adipamide curing agent into the uniform viscous mixture, and continue to stir until it becomes a small block paste.

[0031] Preparation of high thermal conductivity composite material: according to the material ratio in Table 1, add PA6 resin, prepared graphite thermal conductivity filler and other additives into the mixer and mix them, then add them into the twin...

Embodiment 2

[0034] Preparation of graphite heat-conducting filler: Weigh 3 parts by weight of flake graphite powder with a D50 particle size of 11 μm and 20 parts by weight of non-flaky graphite powder with a D50 particle size of 200 μm, and mix them uniformly at a high speed at a temperature of 80° C. to obtain a graphite mixture; weigh Put 3 parts by weight of low-viscosity bisphenol A liquid epoxy resin into the planetary power mixer, raise the temperature to 100°C, and slowly put the graphite mixture into the planetary power mixer in 3 times while stirring, and stir to make it uniform Add 2 parts by weight of tetrakis (2-hydroxyethyl) adipamide curing agent into the viscous mixture, and continue to stir until it becomes a small block paste.

[0035] Preparation of high thermal conductivity composite material: according to the material ratio in Table 1, add PA6 resin, prepared graphite thermal conductivity filler and other additives into the mixer and mix them, then add them into the tw...

Embodiment 3

[0038]Preparation of graphite heat-conducting filler: Weigh 6 parts by weight of flake graphite powder with a D50 particle size of 9.5 μm and 29 parts by weight of non-flaky graphite powder with a D50 particle size of 185 μm, and mix them at a high speed at a temperature of 80 ° C to obtain a graphite mixture; Take 5 parts by weight of low-viscosity bisphenol A liquid epoxy resin and put it into a planetary power mixer, raise the temperature to 100°C, and slowly put the graphite mixture into the planetary power mixer in 3 times under stirring, and stir to make Add 2 parts by weight of tetrakis (2-hydroxyethyl) adipamide curing agent into the uniform viscous mixture, and continue to stir until it becomes a small block paste.

[0039] Preparation of high thermal conductivity composite material: according to the material ratio in Table 1, add PA46 resin, prepared graphite thermal conductivity filler and other additives into the mixer and mix them, then add them into the twin-screw...

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Abstract

The invention relates to a heat-conducting filler containing crystalline flake graphite, a preparation method of the heat-conducting filler, and application of the heat-conducting filler to preparation of a high heat-conducting composite material, and belongs to the field of high molecular material modification and heat-radiation material utilization. The heat-conducting filler is granular lump paste comprising the following components in parts by weight: 1-10 parts of 1-100 (mu)m crystalline flake graphite, 20-55 parts of 100-500 (mu)m non-crystalline flake graphite, 2-10 parts of liquid epoxy resin and 1-5 parts of curing agent. According to the heat-conducting filler of the high heat-conducting composite material and the preparation method of the heat-conducting filler, the heat-conducting filler containing the crystalline flake graphite is processed into a granule, so that blanking is easy in use; no breakage problem exists during extrusion production at high filling capacity; the production efficiency of the heat-conducting composite material is improved; application scope of the heat-conducting filler containing the crystalline flake graphite is widened. The high heat-conducting composite material widens application of heat-conducting plastic in components with higher heat-radiation requirements in the fields of heat radiators, electric products, automobiles, LED illumination and the like.

Description

technical field [0001] The invention relates to a flake-containing graphite heat-conducting filler and a preparation method thereof, and the heat-conducting filler is used for preparing a high-heat-conducting composite material, and belongs to the fields of polymer material modification and heat-dissipating material utilization. Background technique [0002] With the rapid development of the automobile and electronics industries, high-integration, ultra-high-integration integrated circuits and LED industrial applications have emerged, which have made great contributions to technological progress and social development, but have also brought serious problems. Electronic products and LED energy-saving lamps will generate a lot of heat when they are used. If the heat cannot be dissipated in time, the efficiency of the product will be reduced, and its service life will also be reduced. Therefore, people put forward higher and higher requirements for thermally conductive material...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K7/00C08K3/04C08L77/02C08L77/06C08L81/02C08L101/12C08K13/04C08K7/06C08K7/14C09K5/14
CPCC08K3/04C08K7/00C08K2201/003C08K2201/014C08L77/02C08L77/06C08L81/02C08L101/12C08L2203/20C09K5/14C08L63/00C08K13/04C08K7/06C08K7/14
Inventor 巩玉钊金慧星王延军魏小东陈光辉周永松徐淑芬
Owner BENSONG ENG PLASTICS HANGZHOU
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