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Compressible gasket and preparation method therefor, and electronic product comprising same

A gasket and electromagnetic wave technology, applied in layered products, electrical equipment shells/cabinets/drawers, mechanical equipment, etc., can solve the problem that conductive compressible gaskets cannot meet the requirements of system thermal management design and electromagnetic compatibility design at the same time

Active Publication Date: 2017-08-08
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the current electronic material market, the single-function conductive compressible gasket widely used by customers cannot meet the requirements of customer R&D engineers for system thermal management design and electromagnetic compatibility design

Method used

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  • Compressible gasket and preparation method therefor, and electronic product comprising same
  • Compressible gasket and preparation method therefor, and electronic product comprising same
  • Compressible gasket and preparation method therefor, and electronic product comprising same

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Experimental program
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specific Embodiment approach 1

[0058] Embodiment 1 is a compressible gasket comprising an open-cell foam matrix and a filling medium filled and consolidated in the open cells of the open-cell foam, the filling medium comprising a curable adhesive and dispersed therein One or more micron particles, the one or more micron particles include at least one of micron particles with thermally conductive properties and at least one of micron particles with thermally and electrically conductive properties, and optionally include micron particles with flame retardant properties At least one of particles, microparticles with conductive properties, and microparticles with electromagnetic wave absorption properties.

specific Embodiment approach 2

[0059] Embodiment 2 is the compressible pad according to Embodiment 1, wherein more than 20%, or more than 30%, or more than 50%, up to 100% of the open-cell foam matrix is ​​covered by the Fill with the filling medium described above.

specific Embodiment approach 3

[0060] Embodiment 3 is the compressible pad according to Embodiment 1 or 2, wherein the open-cell foam matrix is ​​an open-cell foam formed by foaming a polymer elastic material or a thermoelastomer.

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Abstract

The invention provides a compressible gasket and an electronic product comprising the same, and a preparation method for the compressible gasket. The compressible gasket disclosed in the invention comprises a pore foam substrate and a filling medium which fills and is solidified in the pores of the pore foam substrate; the filling medium comprises a solidifiable adhesive and one or more kinds of micron particles dispersed therein; one or more kinds of micron particles comprise at least one kind of micron particles with heat conducting property and micron particles with heat conducting and conductive properties, and are optionally selected from at least one kind of micron particles with flame-retardant property, micron particles with conductive property and micron particles with electromagnetic wave absorption property. The compressible gasket has the effect of impact and vibration absorption and the sealing function, and also can satisfy the requirements of system heat management design and / or electromagnetic compatibility design.

Description

technical field [0001] The present disclosure relates to a novel compressible liner and its preparation method and electronic products containing the compressible liner. The novel compressible liner is mainly used in the personal mobile consumer electronics market, such as smart wearable devices, mobile phones, tablets Inside computers and laptops, it meets the design requirements of electromagnetic compatibility and thermal management of the system, and can also be used in electronic power equipment that needs to meet the above functions, such as automotive electronics, medical electronics, white goods, etc. Background technique [0002] With the widespread use of high-frequency, high-performance computing processors in personal mobile electronic devices, and the development trend of thinner and thinner structural designs, how to carry out effective thermal management design and electromagnetic compatibility design has become a key issue in the design of personal mobile elec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/02H05K5/06H05K7/20H05K9/00
CPCH05K5/0217H05K5/069H05K7/20H05K9/0081F16J15/064G11B33/1466B32B5/18B32B2255/102B32B2255/205B32B2255/26B32B2266/06B32B2307/212C08J7/08C08J7/044C08J7/05
Inventor 魏嵬陈良方敬杰弗里·W·麦卡琴
Owner 3M INNOVATIVE PROPERTIES CO