Medium-density fiberboard sawing method and sawing device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- WUHAN UNIV OF SCI & TECH
- Publication Date
- 2017-08-18
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Abstract
Description
technical field
[0001] The invention belongs to the technical field of medium fiber board cutting, and in particular relates to a medium fiber board sawing method and a sawing device. Background technique
[0002] MDF is a kind of density board, including long fiberboard and short fiberboard. It is a kind of man-made board made of wood fiber or other plant fiber as raw material, after crushing, fiber separation, drying, applying urea-formaldehyde resin or other suitable adhesives, and then hot pressing. Its density is generally 0.5-0.8 g / cm 3 Range, the thickness is generally 3-30 mm. Because the surface of medium density fiberboard is flat and smooth, it can not only glue planed veneer and tissue paper and other decorative materials, but also facilitate painting and save paint, and can be produced from 3mm-30mm, which can replace wood boards and square materials of any thickness. , and has good machining performance, sawing, drilling, grooving, tenoning, sanding and engr...