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Electronic equipment, ceramic component and preparation method of ceramic component

A technology for electronic equipment and components, applied in the field of ceramic components and their preparation, and electronic equipment, can solve the problems of difficult processing, high hardness, low productivity, etc., reduce machining time, improve mechanical properties and mechanical strength, reduce The effect of wall thickness

Active Publication Date: 2017-08-18
BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, due to the difference in demand and processing details in various industries, ceramic components, especially 3D curved ceramic components, are difficult to process due to their high hardness, resulting in higher costs and lower production capacity. The development of the field of electronic equipment has been greatly restricted

Method used

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  • Electronic equipment, ceramic component and preparation method of ceramic component
  • Electronic equipment, ceramic component and preparation method of ceramic component
  • Electronic equipment, ceramic component and preparation method of ceramic component

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Embodiment Construction

[0039] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatuses and methods consistent with aspects of the present disclosure as recited in the appended claims.

[0040] The terminology used in this application is for the purpose of describing particular embodiments only, and is not intended to limit the application. As used in this application and the appended claims, the singular forms "a", "the", and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. It should also be understood that the te...

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Abstract

The invention discloses electronic equipment, a ceramic component and preparation method of the ceramic component. The preparation method of the ceramic component comprises the following steps: preparing ceramic slurries; processing the prepared ceramic slurries to obtain a plurality of blank film sheets; selecting not less than two blank film sheets from the plurality of blank film sheets according to the designed thickness of the ceramic component, and overlapping the selected blank film sheets to obtain blank film laminated sheets; laminating the blank film laminated sheets to obtain blank film flat sheets; enabling the blank film flat sheets to be subjected to secondary laminating according to the designed shape of the ceramic component to obtain a profiling blank; sintering and processing the profiling blank to obtain the ceramic component. Through the technical scheme disclosed by the invention, the using consumption of a ceramic raw material and the machining time can be reduced, the machining cost of the product is reduced, the machining efficiency and the yield of the equipment are improved, the uniformity of distribution of ceramic particles and a crystal phase structure is improved, the sintering density and strength can be improved, and the mechanical property of the ceramic component is improved.

Description

technical field [0001] The present disclosure relates to the technical field of ceramic components, in particular to an electronic device, a ceramic component and a preparation method thereof. Background technique [0002] With the continuous improvement of people's appreciation level and aesthetic concept, the pursuit of electronic equipment casing materials is no longer simply limited to plastic and metal materials, and ceramic materials used in luxury products such as watches have also received people's attention and favor. The material has a smooth surface and excellent grip, and has excellent hardness and wear resistance, so it is increasingly used in the structure and components of electronic devices such as mobile phones and tablets. [0003] However, due to the difference in demand and processing details in various industries, ceramic components, especially 3D curved ceramic components, are difficult to process due to their high hardness, resulting in higher costs an...

Claims

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Application Information

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IPC IPC(8): B32B18/00B32B37/10B32B37/06C04B35/622
Inventor 杨文哲
Owner BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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