Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Apparatus and method for treatment of flexible substrates using electron beam

A charged particle beam and substrate technology, applied to circuits, discharge tubes, electrical components, etc., can solve problems such as unusable substrates, reduced substrate quality, and interruptions

Active Publication Date: 2017-08-18
APPLIED MATERIALS INC
View PDF3 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] During manufacturing processes using electron sources, operating conditions can cause electrical discharges (such as arcing) that disturb and / or interrupt the voltage supply
Disruption and / or interruption of the voltage supply, for example, to the electron source during the fabrication process can cause disruption of the electron beam, which can degrade the quality of the substrate being fabricated
Even if this interruption occurs only for a fraction of a second (for example, a few milliseconds), the detrimental effect on the substrate may be sufficient to render the substrate unusable

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Apparatus and method for treatment of flexible substrates using electron beam
  • Apparatus and method for treatment of flexible substrates using electron beam
  • Apparatus and method for treatment of flexible substrates using electron beam

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] Reference numerals will now be used in detail for various embodiments, one or more examples of which are depicted in each of the drawings. In the following description about the drawings, the same reference numerals denote the same elements. In general, only the differences of individual implementations are described. Each example is offered by way of explanation, not limitation. For example, features illustrated or described as part of one embodiment can be used on or combined with other embodiments to yield a still further embodiment. The present disclosure is intended to cover such modifications and variations.

[0024] Embodiments described herein relate to electron sources, particularly linear electron sources and methods of operating electron sources, which can be used in a variety of applications. According to embodiments herein, a beam of charged particles generated by an electron source can be displaced to improve today's methods of manufacturing substrates,...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

According to the present disclosure, a charged particle device for treatment of a moveable substrate and a method for treatment of a moving substrate in a processing system are provided. The charged particle device includes a source for forming a beam of charged particles for treatment of the substrate moving along a transport direction and a beam displacement device for moving the beam of charged particles from a first beam trajectory to at least a second beam trajectory along the transport direction.

Description

technical field [0001] The present disclosure relates to an apparatus and method for processing flexible substrates. In particular, the present disclosure relates to an apparatus and method for processing flexible substrates using electron beams to allow for more homogenous processing of the substrates. Background technique [0002] Electron sources are known from various fields. For example, electron beams are used for material modification, surface charge accumulation, sample imaging, and the like. [0003] In order to reduce cost of ownership, today's manufacturing processes for processing large area substrates or flexible substrates (webs) such as for the manufacture of large area foils, thin film solar cells, and the like have a tendency to increase overall processing rates. Furthermore, in order to increase the throughput of manufacturing equipment, the energy density provided by the source on the substrate, foil, thin layer, or flexible substrate may also be increas...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01J37/077H01J37/304
CPCH01J37/077H01J37/304H01J2237/30455H01J2237/30483G21K5/04G21K5/10
Inventor 贡特尔·克莱姆沃尔克·哈克罗兰·特拉斯尔
Owner APPLIED MATERIALS INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com