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Technology for silicon ingot cutting through novel steel wire and solvent

A cutting process and steel wire technology, applied in the field of silicon ingot cutting process using new steel wire and solvent, can solve the problems of reduced cutting ability, reduced adhesion ability, wire breakage, etc., to improve the pass rate of slices, reduce line marks and The effect of chipping and missing corners

Inactive Publication Date: 2017-09-01
NANTONG ZONGYI NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The cutting fluid with this formula needs to strictly prevent the entry of water, because the entry of water will greatly reduce the adhesion of the steel wire to the mortar when cutting silicon wafers, reduce the cutting ability, and even cause wire breakage during the cutting process

Method used

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Examples

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Effect test

Embodiment

[0012] A silicon ingot cutting process using a new type of steel wire and a solvent, including the following steps: loading the rod, installing the crystal rod on the machine—replacing the steel wire, installing a new 110um steel wire—replacing the mortar, and beating the prepared and stirred mortar Put into the equipment mortar tank—preparation before cutting, check machine status, check process parameters—cutting—post-cutting treatment; the mortar in the cutting is mixed with silicon carbide and DEG in a ratio of 1:1, and the carbonization The silicon specification is No. 1500, the diameter is 8 microns, and the DEG is a water-based cutting solvent of diethylene glycol. The rod loading is to glue the silicon rod on the glass with glue. During the cutting, the cutting mortar is driven to grind the silicon ingot, and finally the silicon ingot is cut into silicon wafers with a thickness of 200 microns.

[0013] The invention adopts the water-based cutting solvent DEG instead o...

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Abstract

The invention discloses a technology for silicon ingot cutting through a novel steel wire and solvent. The technology comprises the following steps that bar feeding is carried out, wherein a crystal bar is installed on a machine; a steel wire is replaced, and a novel 110 micrometer steel wire is installed; mortar is replaced, and allocated and stirred mortar is pumped into an equipment mortar cylinder; a preparation is made before cutting, the state of a machine tool is checked, and technological parameters are checked; and cutting is carried out, and treatment after cutting is carried out. The mortar in cutting is formed by mixing silicon carbide and DEG according to the proportion being 1:1, the specification of the silicon carbide is No.1500, the diameter is 8 micrometers, and the DEG is a water-based cutting solvent of diethylene glycol. According to the technology, PEG is replaced with the water-based cutting solvent DEG for cutting; meanwhile, the cutting steel wore and the mated cutting process are studied, the problems of line marks, edge breakage, corner shortage and the like in the slicing process are solved, and the slicing yield is improved.

Description

technical field [0001] In particular, the invention relates to a silicon ingot cutting process using a novel steel wire and solvent. Background technique [0002] In the cutting process of solar silicon wafers, oily PEG is generally used as the mother liquor of cutting mortar. The cutting fluid with this formula needs to strictly prevent the entry of water, because the entry of water will greatly reduce the adhesion of the steel wire to the mortar when cutting silicon wafers, reduce the cutting ability, and even cause wire breakage during the cutting process. [0003] However, the new water-based DEG cutting fluid does not need to worry about the reduction of cutting ability due to water ingress, which can reduce the requirements on the cutting environment and also has certain cost advantages. Contents of the invention [0004] Purpose of the invention: In order to solve the deficiencies of the prior art, the present invention provides a silicon ingot cutting process usin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04B28D7/00
CPCB28D5/042B28D7/00
Inventor 李振华
Owner NANTONG ZONGYI NEW MATERIAL
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