Technology for silicon ingot cutting through novel steel wire and solvent

A cutting process and steel wire technology, applied in the field of silicon ingot cutting process using new steel wire and solvent, can solve the problems of reduced cutting ability, reduced adhesion ability, wire breakage, etc., to improve the pass rate of slices, reduce line marks and The effect of chipping and missing corners

Inactive Publication Date: 2017-09-01
NANTONG ZONGYI NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The cutting fluid with this formula needs to strictly prevent the entry of water, because the entry of water will greatly reduce the adhesion of the steel wire to the mortar when cutting silicon wafers, reduce the cutting ability, and even cause wire breakage during the cutting process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0012] A silicon ingot cutting process using a new type of steel wire and a solvent, including the following steps: loading the rod, installing the crystal rod on the machine—replacing the steel wire, installing a new 110um steel wire—replacing the mortar, and beating the prepared and stirred mortar Put into the equipment mortar tank—preparation before cutting, check machine status, check process parameters—cutting—post-cutting treatment; the mortar in the cutting is mixed with silicon carbide and DEG in a ratio of 1:1, and the carbonization The silicon specification is No. 1500, the diameter is 8 microns, and the DEG is a water-based cutting solvent of diethylene glycol. The rod loading is to glue the silicon rod on the glass with glue. During the cutting, the cutting mortar is driven to grind the silicon ingot, and finally the silicon ingot is cut into silicon wafers with a thickness of 200 microns.

[0013] The invention adopts the water-based cutting solvent DEG instead o...

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Abstract

The invention discloses a silicon ingot cutting process using a new type of steel wire and a solvent, which includes the following steps: loading the rod, installing the crystal rod on the machine—replacing the steel wire, installing a new type of 110um steel wire—replacing the mortar, and stirring the configuration Put the good mortar into the mortar cylinder of the equipment—preparation before cutting, check the state of the machine tool, check the process parameters—cutting—handling after cutting; the mortar in the cutting is mixed with silicon carbide and DEG in a ratio of 1:1 , the silicon carbide specification is No. 1500, the diameter is 8 microns, and the DEG is a water-based cutting solvent of diethylene glycol. The invention adopts the water-based cutting solvent DEG instead of PEG for cutting, and at the same time, it is necessary to study the cutting steel wire and the supporting cutting process to reduce the problems of line marks, edge collapse and missing corners in the slicing process, and improve the qualified rate of slicing.

Description

technical field [0001] In particular, the invention relates to a silicon ingot cutting process using a novel steel wire and solvent. Background technique [0002] In the cutting process of solar silicon wafers, oily PEG is generally used as the mother liquor of cutting mortar. The cutting fluid with this formula needs to strictly prevent the entry of water, because the entry of water will greatly reduce the adhesion of the steel wire to the mortar when cutting silicon wafers, reduce the cutting ability, and even cause wire breakage during the cutting process. [0003] However, the new water-based DEG cutting fluid does not need to worry about the reduction of cutting ability due to water ingress, which can reduce the requirements on the cutting environment and also has certain cost advantages. Contents of the invention [0004] Purpose of the invention: In order to solve the deficiencies of the prior art, the present invention provides a silicon ingot cutting process usin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04B28D7/00
CPCB28D5/042B28D7/00
Inventor 李振华
Owner NANTONG ZONGYI NEW MATERIAL
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