Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Routing common method for different impedance signal lines and PCB board

A PCB board and impedance signal technology, which is applied in the field of PCB wiring, can solve the problems of increasing PCB board production costs, affecting product efficiency and reliability, and reducing PCB board production yield, so as to reduce development costs and reduce high-speed wiring Quantity, size reduction area and effects of laminated layers

Inactive Publication Date: 2017-09-01
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
View PDF4 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, increasing the area of ​​the PCB board and the number of laminated layers will increase the production cost of the PCB board card. At the same time, the larger the area of ​​the board card and the increase in the number of layers will also increase the complexity of the PCB board factory's processing and reduce the cost of the PCB board. Board production yield
[0008] The use of the cable external connection method will also increase the development cost due to the increase in the number of cables. At the same time, due to the large number of cables, it will bring more changes to the later equipment interconnection and maintenance, which will affect the actual use of the product. efficiency and reliability

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Routing common method for different impedance signal lines and PCB board
  • Routing common method for different impedance signal lines and PCB board
  • Routing common method for different impedance signal lines and PCB board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0024] A method for realizing the sharing of different impedance signal lines. The implementation process is to connect the signal lines of different impedance values ​​on the PCB board to Cap capacitors, and then share the PCB Trace channel between all cap capacitors. The Cap The capacitor is used as a Bom switching switch to perform Bom switching, so that the wiring of all signal lines on the PCB board is merged into one.

[0025] The impedance value of the shared PCB Trace channel adopts the average value of the impedance values ​​of all signal lines. When the average value is an integer value, the impedance value is the average value; when the average value is a non-integer value, take the rounded integer value is the impedance value.

[0026] The signal lines with different impedance values ​​refer to the SAS3.0 signal line with a Trace i...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a routing common method for different impedance signal lines and a PCB board. The method comprises the steps that signal lines of different impedance values on the PCB board are connected with Cap capacitors; a PCB Trace channel is shared by all cap capacitors; and the Cap capacitors are used as Bom selector switches for Bom switching, so that the routing of all signal lines on the PCB board are integrated. Compared with the prior art, the routing common method for different impedance signal lines and the PCB board have the advantages that the scheme that the transmission channel on the PCB board is shared by buses of different impedance values is used to reduce the number of high speed routing on the board; the function of each bus of a product is realized, and the size, the area and the number of layers of the board are reduced; the development cost of the board is reduced; the market competitiveness of the product is enhanced; and the practicability is high.

Description

technical field [0001] The invention relates to the technical field of PCB wiring, in particular to a method for realizing common routing of signal lines with different impedances and a PCB board. Background technique [0002] With the rapid development of the electronics industry, the design of the server motherboard is developing in the direction of high density and high speed. The size of the PCB board structure is reduced, and the number and speed of the high-speed IO ports output by the CPU chip are greatly increased, so as to enhance the competitiveness of the product in the market. . [0003] However, as the number of IO ports increases, it also means that the number of high-speed signal lines to be routed on the PCB board will increase exponentially. For example, the original CPU only supports one PCIEx16 port, which means that the PCB wiring needs to route 16 pairs of differential lines for each of the PCIE TX and RX channels, and a total of 32 pairs of wiring. Wh...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K1/02
CPCH05K1/0231H05K1/0228H05K1/0296H05K2201/09227
Inventor 武宁
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products