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A high resistivity, low b-value negative temperature coefficient thermosensitive material and preparation method thereof
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A technology with negative temperature coefficient and high resistivity, which is applied to resistors with negative temperature coefficient, resistors, non-adjustable metal resistors, etc., to achieve the effect of simple process, excellent electrical conductivity and good compactness
Active Publication Date: 2020-05-08
山东中厦电子科技有限公司
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Problems solved by technology
At present, the resistivity of materials with high resistivity and low B value on the market is 500-2000Ωcm, and the B value (material coefficient) is in the range of 800-1800K; while the resistivity is 10-100KΩcm, the B value (material coefficient) is in the range of 1000-2200K , which has not been reported yet, has become a major problem in the manufacture of negative temperature coefficient thermistors today
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Embodiment 1
[0022] (1) Formulation: NiO, CuO, Fe 2 o 3 As raw material, the purity is industrial grade, take NiO:CuO:Fe 2 o 3 =28:55:17 (wt%)+5% (additive)=25:55:20 (wt%)+5% (additive)=22:55:23 (wt%)+5% (additive)=18 : 55: 27 (wt%) + 5% (additive); the additive is: Cr 2 o 3 : CaO: ZrO: SiC=20:15:30:35wt%, 24 hours ball milling;
[0023] (2) Ball mill the above proportioned ingredients for 24 hours, material: water: ball = 1.0:1.2:1.5;
[0024] (3) Granulation: Add 24% wt of PVA glue solution with a concentration of 15% to the powder, manually granulate, and pass through a 200-300 mesh sieve;
[0025] (4) Forming: Forming Ф5.4 (mm) × 1.2 (mm) green sheet, the pressing density is 3.2g / cm 3 ;
[0026] (5) Put the formed blank into a ceramic bowl and sinter at a high temperature of 1080°C for 3 hours. The sintering curve is:
[0027] From room temperature to 500°C, the heating rate is 0.5°C / min,
[0028] 500℃~500℃ constant temperature for 2 hours,
[0029] 500℃~800℃, the heating r...
Embodiment 2
[0039] The main formula is NiO: CuO: Fe 2 o 3 =23:52:25 (wt%), the amount of additives was taken as 1.0, 3.0, 5.0, 7.0, 9.0wt%, respectively, and the samples were made according to the process of Example 1. The test results are as follows (statistics based on 100 chips ):
[0040]
[0041] The results show that with the increase of the additive amount, the resistivity and B value change little, and the consistency is best centered around 4% additive, and the consistency becomes larger with the increase or decrease of the additive.
Embodiment 3
[0043] The formula takes NiO, CuO, Fe 2 o 3 =23:52:25 (wt%), the amount of additives is 5wt%, and the green sheet is made according to the process of Example 1, and sintered at different sintering temperatures. The measurement results of the samples are as follows (statistics based on 100 chips):
[0044]
[0045] The results show that as the sintering temperature increases, the resistivity decreases and the B value decreases accordingly.
[0046] The material formula and preparation technology of the present invention can be produced in batches, and the performance of the material meets various parameters required by the temperature sensor. This material has the characteristics of good compactness, high stability, and excellent electrical conductivity, and is an important material required by the sensor. .
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Abstract
The invention relates to the field of heat-sensitive materials and sensors, and particularly discloses a high-resistivity low-B-value negative temperature coefficient heat-sensitive material and a preparation method thereof. The high-resistivity low-B-value negative temperature coefficient heat-sensitive material is characterized in that Ni-Cu-Fe-series oxides are taken as the main formula, and Cr2O3, CaO, ZrO and SiC are added into the main formula, wherein the main formula consists of NiO, CuO and Fe2O3 of which the weight ratio is (15-30):(45-60):(10-35), and the total addition of Cr2O3, CaO, ZrO and SiC accounts for 1-9% of the weight of the main formula. The high-resistivity low-B-value negative temperature coefficient heat-sensitive material has the characteristics that the process is simple, the product can be produced in batches, and good compactness, high stability and favorable conductivity are achieved, and is a material material required by various sensors.
Description
[0001] (1) Technical field [0002] The invention relates to the field of heat-sensitive materials and sensors, in particular to a high-resistivity, low-B value negative temperature coefficient heat-sensitive material and a preparation method thereof. [0003] (2) Background technology [0004] Components and sensors made of high resistivity, low B value negative temperature coefficient thermosensitive materials are used in automotive electronics, temperature compensation of various semiconductor devices and sensors, and components requiring high resistance value / low B value for temperature measurement in a wide temperature range, but Due to the current high resistivity and low B value products at home and abroad, the accuracy is relatively low compared to MEMS digital sensors, so the ability to manufacture higher precision high resistivity / low B value low-cost materials has become the goal pursued by the same industry around the world. [0005] The basic characteristics of neg...
Claims
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Application Information
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