High-dielectric constant epoxy resin composition and preparation method thereof

A technology of high dielectric constant and epoxy resin, which is applied in the preparation of the above-mentioned composition and the field of epoxy resin composition with high dielectric constant, can solve problems such as no clear solution, reduce warpage and reduce chip footprint Phenomenon, the effect of increasing the crosslink density

Active Publication Date: 2017-09-08
JIANGSU HHCK NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Manufacturers of epoxy resin compositions at home and abroad are actively researching and developing, so far there is no clear solution

Method used

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  • High-dielectric constant epoxy resin composition and preparation method thereof
  • High-dielectric constant epoxy resin composition and preparation method thereof
  • High-dielectric constant epoxy resin composition and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Embodiment 1, a kind of high dielectric constant epoxy resin composition: the main component of this epoxy resin composition includes: epoxy resin, curing agent, curing agent accelerator, high dielectric filler, stress absorber and fumed white carbon black; described epoxy resin is to contain the epoxy resin described in following formula (1):

[0046]

[0047] Formula 1)

[0048] The curing agent is a phenolic resin, which contains the phenolic resin described in formula (3), wherein, m and n are integers of 1-15,

[0049]

[0050] Formula (3)

[0051] The weight of described epoxy resin accounts for 5% of epoxy resin composition gross weight;

[0052] The weight of described curing agent accounts for 10% of epoxy resin composition gross weight;

[0053] Described curing agent accelerator accounts for 0.05% of epoxy resin composition gross weight;

[0054] Then add other appropriate amount of commonly used additives.

Embodiment 2

[0055] Embodiment 2, a kind of high dielectric constant epoxy resin composition: the main component of this epoxy resin composition includes: epoxy resin, curing agent, curing agent accelerator, high dielectric filler, stress absorber and fumed white carbon black; the epoxy resin contains the epoxy resin described in formula (1) and formula (2):

[0056] The curing agent is a phenolic resin, which contains the phenolic resin described in formula (3);

[0057] The weight of described epoxy resin accounts for 18% of epoxy resin composition gross weight;

[0058] The weight of described curing agent accounts for 10% of epoxy resin composition gross weight;

[0059] The curing agent accelerator accounts for 1% of the total weight of the epoxy resin composition.

Embodiment 3

[0060] Embodiment 3, a kind of high dielectric constant epoxy resin composition: the main components of this epoxy resin composition include: epoxy resin, curing agent, curing agent accelerator, high dielectric filler, stress absorber and fumed white carbon black; described epoxy resin is to contain the epoxy resin described in following formula (1) and formula (2):

[0061] The curing agent is a phenolic resin, which contains the phenolic resin described in formula (3);

[0062] The weight of described epoxy resin accounts for 15% of epoxy resin composition gross weight;

[0063] The weight of described curing agent accounts for 5% of epoxy resin composition gross weight;

[0064] Described curing agent accelerator accounts for 1.5% of epoxy resin composition gross weight;

[0065] The high dielectric filler is selected from alumina or titanate; the titanate is preferably one or more of barium titanate, calcium titanate, strontium titanate or other ferroelectric ceramic mat...

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Abstract

The invention relates to a high-dielectric constant epoxy resin composition. The high-dielectric constant epoxy resin composition is characterized by being composed of main components of epoxy resin, curing agent, curing agent promoter, high-dielectric constant filler, stress absorbing agent and fumed silica, wherein the epoxy resin contains either of the following formulas of (1) and / or (2); the curing agent is phenolic resin and contains a formula of (3); the weight percentage of the epoxy resin in the high-dielectric constant epoxy resin composition is 1-25%, preferably, 2-18%; the weight percentage of the curing agent in the high-dielectric constant epoxy resin composition is 0.01-2%, preferably, 0.05-1%. The invention also discloses a preparation method of the high-dielectric constant epoxy resin composition. By optimizing the type of the epoxy resin composition, the type of phenolic resin composition and the type and the adding method of the stress absorbing agent, the invention provides the high-dielectric constant epoxy resin composition, which is low in porosity, capable of ensuring die mark to be within an acceptable range, low in warpage and high in reliability.

Description

technical field [0001] The present invention relates to a kind of high dielectric constant epoxy resin, relate in particular to a kind of fingerprint module package LGA (LandGrid Array, i.e. the epoxy resin composition of grid array) with high dielectric constant; The present invention also relates to the aforementioned Method of preparation of the composition. Background technique [0002] Fingerprint identification has almost become synonymous with biometric identification by virtue of its "unique" uniqueness and "lifetime unchanged" invariance and convenience. Fingerprint sensors are a promising key device for device identification. According to the sensing principle, that is, the principle and technology of fingerprint imaging, fingerprint sensors are divided into optical fingerprint sensors, semiconductor capacitive sensors, semiconductor thermal sensors, semiconductor pressure sensors, ultrasonic sensors and radio frequency RF sensors. At present, due to the requirem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L51/00C08K3/36C08K3/22C08K3/24C08G59/32C08G59/62
CPCC08G59/3227C08G59/621C08K2003/2227C08L63/00C08L2203/206C08L51/003C08K3/36C08K3/22C08K3/24
Inventor 刘红杰谭伟李兰侠范丹丹段杨杨成兴明韩江龙
Owner JIANGSU HHCK NEW MATERIAL CO LTD
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