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Resin composition, copper-clad board, circuit board and manufacturing method

A technology of resin composition and copper clad laminate, applied in the direction of printed circuit, chemical instrument and method, synthetic resin layered products, etc., can solve the problems of low peel strength and poor heat resistance

Inactive Publication Date: 2017-09-22
建滔覆铜板(深圳)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Based on this, it is necessary to provide a resin composition, a copper clad laminate, a circuit board and a manufacturing method for the problems of low peel strength and poor heat resistance caused by increasing the CTI value through high-filling aluminum hydroxide

Method used

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  • Resin composition, copper-clad board, circuit board and manufacturing method
  • Resin composition, copper-clad board, circuit board and manufacturing method
  • Resin composition, copper-clad board, circuit board and manufacturing method

Examples

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preparation example Construction

[0046] see figure 1 Shown, the present invention also provides a kind of preparation method of above-mentioned copper-clad laminate, and this preparation method comprises the following steps:

[0047] S100, a glue compounding step, uniformly mixing each component in the resin composition according to the formula amount to prepare a glue solution.

[0048] Optionally, in S100, the glue compounding step includes the following steps:

[0049] Dissolving the curing agent in a part of the formula amount of solvent to completely dissolve the curing agent to obtain a curing agent solution;

[0050] The accelerator is dissolved in the solvent of the remaining formulation amount to obtain an accelerator solution;

[0051] Stirring and mixing the curing agent solution with low-bromine epoxy resin and bromine-free epoxy resin to obtain a resin solution;

[0052] Aluminum oxyhydroxide is added to the resin solution and mixed with stirring to prepare a resin-aluminum oxyhydroxide mixtur...

Embodiment 1

[0074] Dissolve 2.0kg of dicyandiamide in 22kg of dimethylformamide to completely dissolve the dicyandiamide to prepare a curing agent solution. 0.04 kg of 2-methylimidazole was dissolved in 10 kg of dimethylformamide to prepare an accelerator solution. Add the curing agent solution, 39kg of bromine-free epoxy resin, and 55kg of reactive xanthan resin into the high-shear cylinder, and stir and mix at a speed of 1400r / min to prepare a resin solution. Add 45kg of aluminum oxyhydroxide to the resin solution and stir and mix at a speed of 1400r / min. During stirring, control the temperature not higher than 45°C and keep stirring for 1h to obtain a resin-aluminum oxyhydroxide mixture. Add the accelerator solution to the resin-aluminum oxyhydroxide mixture, stir and mix at a speed of 1400r / min, and keep stirring for 1h to obtain a glue solution.

[0075] Measure the viscosity of the glue, when the viscosity is 25+ / -10s / 4 # When the cup is used, transfer it to a common cylinder and ...

Embodiment 2

[0091] Dissolve 2.0kg of dicyandiamide in 22kg of dimethylformamide to completely dissolve the dicyandiamide to prepare a curing agent solution. 0.04 kg of 2-methylimidazole was dissolved in 10 kg of dimethylformamide to prepare an accelerator solution. Add the curing agent solution, 39kg of bromine-free epoxy resin, and 55kg of reactive xanthan resin into the high-shear cylinder, and stir and mix at a speed of 1400r / min to prepare a resin solution. Add 45kg of aluminum oxyhydroxide to the resin solution in portions and stir and mix at a speed of 1400r / min. During stirring, control the temperature not higher than 45°C and keep stirring for 1h to obtain a resin-aluminum oxyhydroxide mixture. Add the accelerator solution to the resin-aluminum oxyhydroxide mixture, stir and mix at a speed of 1400r / min, and keep stirring for 1h to obtain a glue solution.

[0092] Measure the viscosity of the glue, when the viscosity is 25+ / -10s / 4 # When the cup is used, transfer it to a common c...

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Abstract

The invention discloses a resin composition, a copper-clad board, a circuit board and a manufacturing method. The resin composition comprises, by weight, 52-62 parts of low-bromine epoxy resin, 35-45 parts of bromine-free epoxy resin, 1.8-2.2 parts of curing agents, 0.02-0.06 part of accelerators, 20-60 parts of hydroxyl aluminum oxide and 20-40 parts of solvents. The resin composition, the copper-clad board, the circuit board and the manufacturing method have the advantages that hydroxyl aluminum oxide inorganic fillers are added to the resin composition, accordingly, a CTI (comparative tracking index) value of copper-clad board can be increased, the heat resistance, the acid and alkali resistance and the peel strength of the copper-clad board can be greatly improved, and application spaces of the prepared copper-clad board can be effectively expanded.

Description

technical field [0001] The invention relates to the technical field of printed circuits, in particular to a resin composition, a copper clad laminate, a circuit board and a manufacturing method. Background technique [0002] As the insulating base material of printed circuit boards, copper clad laminates are widely used in various electronic and electrical products. Printed circuit boards used in harsh environments will accumulate dust and moisture condensation on the surface. Under the action of applied voltage, electric sparks will be generated repeatedly between the lines, and then traces of carbonized conductive circuits will be formed, destroying the insulation of the insulating substrate. performance. The index to measure the tracking resistance of copper clad laminates is the Comparative Tracking Index (CTI). The IEC-112 standard method is often used for testing. This method defines the highest voltage value of the CTI-defined plate (the copper foil is etched on the...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K13/06C08K5/3445C08K3/22C08K9/04C08J3/09B32B15/092B32B15/20B32B27/18B32B27/26B32B27/38
CPCC08L63/00B32B15/092B32B15/20B32B27/18B32B27/26B32B27/38B32B2457/08C08J3/096C08J2363/00C08J2463/00C08K2003/2227C08K2201/003C08L2201/08C08L2203/20C08L2205/025H05K1/0353H05K3/022C08K13/06C08K5/3445C08K3/22C08K9/04
Inventor 张志勤
Owner 建滔覆铜板(深圳)有限公司
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