A MEMS Acceleration Sensor Based on Heat Convection Principle

An acceleration sensor and micro-mechanical technology, applied in the direction of measuring acceleration, velocity/acceleration/impact measurement, acceleration measurement using inertial force, etc., can solve problems such as large sensitivity coefficient, large temperature drift of acceleration sensor, and use temperature limit

Active Publication Date: 2021-05-28
HANGZHOU DIANZI UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The piezoresistive acceleration sensor has a large sensitivity coefficient and high resolution, but the temperature drift of this type of acceleration sensor is large, and the use temperature is limited

Method used

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  • A MEMS Acceleration Sensor Based on Heat Convection Principle
  • A MEMS Acceleration Sensor Based on Heat Convection Principle
  • A MEMS Acceleration Sensor Based on Heat Convection Principle

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Embodiment Construction

[0038] The present invention will be further described below in conjunction with the embodiments and accompanying drawings, but the present invention is by no means limited to the described embodiments.

[0039] Embodiments of the present invention relate to a thermal convection micromachined acceleration sensor, such as figure 1 As shown, a layer of polyimide film is made on the polished surface of the first substrate, the polyimide film is etched to form a groove in the reference area, and aluminum oxide is regrown to form an alumina reference area. The surface of this reference area is different from other The surface of the polyimide area is on the same plane; the main active part is composed of a heating resistor and a sensing resistor, both of which are made on the polyimide film, and the length, width, thickness and shape of the two sensing resistors are the same, Symmetrically placed on both sides of the heating resistor, the distance to the heating resistor is equal; ...

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Abstract

The invention relates to the design and manufacturing method of a micro-mechanical acceleration sensor based on the heat convection principle. The thermal convection micro-mechanical acceleration sensor involved in the present invention does not open a hole on the silicon chip to form a cavity structure, but forms a closed cavity by bonding the glass cover plate and the silicon chip through BCB bonding glue, and in the first A layer of polyimide film is made on the substrate to prevent heat loss, to ensure that the hot air mass plays a better role and reduce power consumption. In addition, the polyimide film can also prevent the leakage of platinum electrodes. This design makes the process easier. The method is simple and the fabricated sensor has a more stable structure, high reliability and better performance.

Description

technical field [0001] The invention belongs to the technical field of micro-electro-mechanics, relates to a micro-inertial sensor, in particular to the design and manufacturing method of a micro-mechanical acceleration sensor based on the principle of thermal convection. Background technique [0002] In recent years, the application fields of micro-machined acceleration sensors have become wider and wider, and the market has become larger and larger. With the rapid development of micro-machining technology, more and more high-performance micro-machined acceleration sensors have been developed. Micromechanical acceleration sensors can be divided into capacitive, piezoresistive, piezoelectric, tunnel current, thermal convection, resonant and other types according to different principles. Among them, the capacitive acceleration sensor has high sensitivity and good stability. The temperature coefficient is small and other advantages, so the acceleration sensor based on capacita...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01P15/08
CPCG01P15/0897G01P2015/0862
Inventor 汶飞刘晓阳李丽丽王高峰叶剑飞王路文吴薇
Owner HANGZHOU DIANZI UNIV
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