Printed circuit board device manufacture method

A technology for printed circuit boards and manufacturing methods, which is applied in the directions of printed circuit manufacturing, printed circuits, and assembling printed circuits with electrical components, can solve problems such as low manufacturing efficiency, improve welding efficiency, improve demolding efficiency, and avoid solder paste. The effect of uneven coating

Active Publication Date: 2017-09-22
深圳市路远电子科技有限公司
View PDF7 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present invention provides an efficient method for manufacturing a printed circuit board device, which

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed circuit board device manufacture method
  • Printed circuit board device manufacture method
  • Printed circuit board device manufacture method

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0063] Please refer to the drawings, where the same component symbols represent the same components, and the principle of the present invention is implemented in an appropriate computing environment for illustration. The following description is based on the illustrated specific embodiments of the present invention, and should not be construed as limiting other specific embodiments of the present invention that are not detailed here.

[0064] Please refer to figure 1 , figure 1 It is a schematic diagram of the work flow of the manufacturing method of the printed circuit board device of the present invention; the manufacturing method of the printed circuit board device of the present invention includes:

[0065] Obtain the PCB rigid board 40, and determine the position of the pad on the PCB rigid board 40;

[0066] Using the solder paste printer 10, apply solder paste 60 on the pad positions on the PCB rigid board 40;

[0067] Use the SPI solder paste inspection machine to detect wheth...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a printed circuit board device manufacture method. The method comprises the steps that a PCB hard board is acquired; a solder paste printer is used to coat solder paste on the pad of the PCB hard board; whether the solder paste coated on the pad by the solder paste printer is qualified is detected; a corresponding electronic component is surface-mounted on the qualified pad detected by an SPI solder paste detector; welding operation is carried out on the electronic component on the corresponding pad; defect detection is carried out on the PCB hard board on which the electronic component is welded; an automatic glue sprayer is used to glue and cover the welding area of the electronic component and the pad on the PCB hard board whose defect detection is qualified; high temperature curing is carried out on the glued and covered PCB hard board; an FPC soft board is acquired, and a soft and hard board assembly fixture is used to assemble the PCB hard board after high temperature curing and the FPC soft board; and the PCB hard board and the FPC soft board on the soft and hard board assembly fixture are welded to form a printed circuit board device.

Description

technical field [0001] The invention relates to a method for manufacturing a printed circuit board device, in particular to a method for manufacturing an efficient printed circuit board device. Background technique [0002] With the development of the electrical industry, manufacturers have an increasing demand for printed circuit board devices, such as soft and hard boards. In addition, as printed circuit board devices are the basic components of electrical appliances in the electrical industry, they play a considerable role. important role. [0003] In the existing manufacturing method for producing printed circuit board devices, the processing and processing of corresponding materials by each unit lacks comprehensive consideration of the correlation processing of subsequent process units, thereby reducing the efficiency of the manufacturing process. [0004] Therefore, it is necessary to provide an efficient method for manufacturing printed circuit board devices to solve...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K3/34H05K3/36
CPCH05K3/3494H05K3/363H05K2203/043H05K2203/162
Inventor 马瑞海匡思令
Owner 深圳市路远电子科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap