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Printed circuit board device manufacture method

A technology for printed circuit boards and manufacturing methods, which is applied in the directions of printed circuit manufacturing, printed circuits, and assembling printed circuits with electrical components, can solve problems such as low manufacturing efficiency, improve welding efficiency, improve demolding efficiency, and avoid solder paste. The effect of uneven coating

Active Publication Date: 2017-09-22
深圳市路远电子科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present invention provides an efficient method for manufacturing a printed circuit board device, which solves the technical problem of low manufacturing efficiency of the existing method for manufacturing a printed circuit board device

Method used

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  • Printed circuit board device manufacture method
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  • Printed circuit board device manufacture method

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Embodiment Construction

[0063] Referring to the drawings, wherein like reference numerals represent like components, the principles of the present invention are exemplified when implemented in a suitable computing environment. The following description is based on illustrated specific embodiments of the invention, which should not be construed as limiting other specific embodiments of the invention not described in detail herein.

[0064] Please refer to figure 1 , figure 1 It is a schematic workflow diagram of the manufacturing method of the printed circuit board device of the present invention; the manufacturing method of the printed circuit board device of the present invention includes:

[0065] Obtain the PCB hard board 40, and determine the pad position on the PCB hard board 40;

[0066] Use the solder paste printing machine 10 to apply solder paste 60 on the pad position on the PCB hard board 40;

[0067] Use the SPI solder paste inspection machine to detect whether the solder paste 60 on t...

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Abstract

The invention provides a printed circuit board device manufacture method. The method comprises the steps that a PCB hard board is acquired; a solder paste printer is used to coat solder paste on the pad of the PCB hard board; whether the solder paste coated on the pad by the solder paste printer is qualified is detected; a corresponding electronic component is surface-mounted on the qualified pad detected by an SPI solder paste detector; welding operation is carried out on the electronic component on the corresponding pad; defect detection is carried out on the PCB hard board on which the electronic component is welded; an automatic glue sprayer is used to glue and cover the welding area of the electronic component and the pad on the PCB hard board whose defect detection is qualified; high temperature curing is carried out on the glued and covered PCB hard board; an FPC soft board is acquired, and a soft and hard board assembly fixture is used to assemble the PCB hard board after high temperature curing and the FPC soft board; and the PCB hard board and the FPC soft board on the soft and hard board assembly fixture are welded to form a printed circuit board device.

Description

technical field [0001] The invention relates to a method for manufacturing a printed circuit board device, in particular to a method for manufacturing an efficient printed circuit board device. Background technique [0002] With the development of the electrical industry, manufacturers have an increasing demand for printed circuit board devices, such as soft and hard boards. In addition, as printed circuit board devices are the basic components of electrical appliances in the electrical industry, they play a considerable role. important role. [0003] In the existing manufacturing method for producing printed circuit board devices, the processing and processing of corresponding materials by each unit lacks comprehensive consideration of the correlation processing of subsequent process units, thereby reducing the efficiency of the manufacturing process. [0004] Therefore, it is necessary to provide an efficient method for manufacturing printed circuit board devices to solve...

Claims

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Application Information

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IPC IPC(8): H05K3/34H05K3/36
CPCH05K3/3494H05K3/363H05K2203/043H05K2203/162
Inventor 马瑞海匡思令
Owner 深圳市路远电子科技有限公司
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