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Composite sheet for forming resin film, and method for producing chip with resin film

A technology of resin film and composite sheet, which is applied in the field of chip manufacturing and can solve problems such as peeling

Active Publication Date: 2021-06-15
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the surface of the chip on the opposite side to the side bonded to the substrate (hereinafter also referred to as "the back surface of the chip") may be peeled off.

Method used

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  • Composite sheet for forming resin film, and method for producing chip with resin film
  • Composite sheet for forming resin film, and method for producing chip with resin film
  • Composite sheet for forming resin film, and method for producing chip with resin film

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Effect test

Embodiment 1～9、 comparative example 1

[0367] The types and compounding amounts (active ingredient ratios) of the components shown in Table 1 were mixed and diluted with methyl ethyl ketone to prepare a solution of the resin film-forming composition having a solid content concentration of 61% by mass. .

[0368] Then, the delamination-treated surface of a carrier sheet (manufactured by Lintec Corporation, trade name "SP-PET3811", thickness: 38 μm) composed of a resin film having a delamination-treated surface was coated. The solution of the resin film forming composition was dried at 120° C. for 2 minutes. Then, a film for forming a resin film having a thickness of 25 μm was formed on the carrier sheet to prepare a laminate (1) composed of the carrier sheet and the film for forming a resin film.

[0369] Then, any one of the support sheets (I) to (VII) of the types shown in Table 1 was bonded to the film for forming a resin film of the laminate (1) to produce a laminate in which the support sheet and the resin fil...

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PUM

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Abstract

The present invention provides a composite sheet for forming a resin film, which has a structure in which a film for forming a resin film capable of forming a resin film is directly laminated on a support sheet, and satisfies the following requirements (I) and (II). Requirement (I): After bonding the surface (α) of the resin film-forming film on the side to be bonded to the silicon wafer to the silicon wafer, stretch at a rate of 300 mm / min and pull in an environment of 23° C. The peeling force (α1) required to peel the resin film-forming film from the silicon wafer measured under the peeling condition (x) at an extension angle of 180° is 0.05 to 10.0 N / 25mm; The peeling force (β1) required to peel the support sheet from the surface (β) of the resin film-forming film on the side directly laminated with the support sheet measured under the peeling condition (x) is the peeling force (α1) or more.

Description

technical field [0001] The present invention relates to a composite sheet for forming a resin film and a method for manufacturing a chip with a resin film using the composite sheet for forming a resin film. Background technique [0002] In recent years, semiconductor devices have been manufactured using a mounting method called a so-called face down method. In the flip-chip method, a semiconductor chip having electrodes such as bumps (hereinafter also simply referred to as a “chip”) is mounted on a circuit surface of the semiconductor chip, and the electrodes of the chip are bonded to a substrate. Therefore, the surface of the chip opposite to the side bonded to the substrate (hereinafter also referred to as "the back surface of the chip") may be exposed. [0003] In some cases, a resin film made of an organic material is formed on the back surface of the peeled chip, and the chip is assembled in a semiconductor device as a chip with the resin film. The resin film can also...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/301B32B7/02B32B27/00C09D7/40C09D201/00C09J7/20C09J201/00
CPCB32B27/00C09D201/00C09J201/00C09D7/40C09J7/20H01L21/52B32B7/12
Inventor 米山裕之佐伯尚哉小桥力也
Owner LINTEC CORP