Method for predicting temperature distribution of semiconductor device

A device temperature and semiconductor technology, applied in instruments, special data processing applications, electrical digital data processing, etc., can solve the problems of computer hardware resources and long calculation time, and achieve the effect of fast and efficient temperature analysis

Pending Publication Date: 2017-09-29
XIDIAN UNIV
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  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a simple, efficient, fast and accurate method for predicting the temperature distribution of semiconductor devices in view of the defects of existing semiconductor temperature

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  • Method for predicting temperature distribution of semiconductor device
  • Method for predicting temperature distribution of semiconductor device
  • Method for predicting temperature distribution of semiconductor device

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Embodiment Construction

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0020] Taking the 1μm GaAs HBT process of Wenmao Semiconductor Company as an example, combined with figure 1 The flow for performing temperature analysis on semiconductor devices in the process library.

[0021] Step 100, according to the given process library file, obtain the model parameters of the active devices used on the chip.

[0022] The model parameters of the active device include the structure of each active region of the device and its geometric p...

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Abstract

The invention discloses a method for predicting temperature distribution of a semiconductor device, and relates to the technical field of integrated circuit analysis. The method comprises the main steps of (1) acquiring model parameters of the active device from a chip, (2) establishing a model of the device in COMSOL, and conducting finite element temperature analysis on the model, (3) conducting function fitting on the temperature distribution of the device in MATLAB, and (4) substituting the power consumption, the area of a heating zone, the ambient temperature and other arguments of the actual active device into a temperature function expression formula, and obtaining the temperature distribution of the device. The method for predicting temperature distribution of a semiconductor device can be widely applied to the field of integrated circuit analysis, and compared with the traditional finite element analysis method, the method for predicting temperature distribution of a semiconductor device has the advantages of omitting the processes of entity model establishment and mesh generation and saving plenty of computer hardware resources and calculation time, and the method for predicting temperature distribution of a semiconductor device can achieve the temperature analysis of the semiconductor device simply, quickly and efficiently.

Description

technical field [0001] The invention relates to the technical field of integrated circuit analysis, in particular to a method for predicting the temperature distribution of semiconductor devices. Background technique [0002] With the rapid development of microelectronics manufacturing technology, the size of semiconductor devices is gradually reduced, and its power density is doubled. cause serious impact. The increase of device temperature will not only affect the electrical performance of the device, but also make the self-heating effect more prominent, which greatly shortens the life of the device and affects its reliability and the performance of the entire chip. Therefore, in the early stage of chip circuit design, it is necessary to analyze the temperature characteristics of the semiconductor devices used and evaluate its influence on the temperature distribution of the chip, so as to formulate corresponding layout guidelines to guide the optimization of chip layout ...

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Application Information

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IPC IPC(8): G06F17/50
CPCG06F30/23G06F30/3323G06F2119/08
Inventor 吕红亮杨施政武岳张玉明张义门李少军
Owner XIDIAN UNIV
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