Method for predicting temperature distribution of semiconductor device

Abstract

The invention discloses a method for predicting temperature distribution of a semiconductor device, and relates to the technical field of integrated circuit analysis. The method comprises the main steps of (1) acquiring model parameters of the active device from a chip, (2) establishing a model of the device in COMSOL, and conducting finite element temperature analysis on the model, (3) conducting function fitting on the temperature distribution of the device in MATLAB, and (4) substituting the power consumption, the area of a heating zone, the ambient temperature and other arguments of the actual active device into a temperature function expression formula, and obtaining the temperature distribution of the device. The method for predicting temperature distribution of a semiconductor device can be widely applied to the field of integrated circuit analysis, and compared with the traditional finite element analysis method, the method for predicting temperature distribution of a semiconductor device has the advantages of omitting the processes of entity model establishment and mesh generation and saving plenty of computer hardware resources and calculation time, and the method for predicting temperature distribution of a semiconductor device can achieve the temperature analysis of the semiconductor device simply, quickly and efficiently.

Description

technical field [0001] The invention relates to the technical field of integrated circuit analysis, in particular to a method for predicting the temperature distribution of semiconductor devices. Background technique [0002] With the rapid development of microelectronics manufacturing technology, the size of semiconductor devices is gradually reduced, and its power density is doubled. cause serious impact. The increase of device temperature will not only affect the electrical performance of the device, but also make the self-heating effect more prominent, which greatly shortens the life of the device and affects its reliability and the performance of the entire chip. Therefore, in the early stage of chip circuit design, it is necessary to analyze the temperature characteristics of the semiconductor devices used and evaluate its influence on the temperature distribution of the chip, so as to formulate corresponding layout guidelines to guide the optimization of chip layout ...

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Problems solved by technology

[0004] The purpose of the present invention is to provide a simple, efficient, fast and accurate method for predicting the temperature distribution of semiconductor devices in view of the defects of existing semiconductor temperature analysis methods that take up a large amount of computer hardware resources and take too long to calculate, so as to accurately predict the temperature distribution of semiconductor devices Temperature distribution during operation

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