The invention discloses a method for predicting temperature distribution of a
semiconductor device, and relates to the technical field of
integrated circuit analysis. The method comprises the main steps of (1) acquiring
model parameters of the active device from a
chip, (2) establishing a model of the device in COMSOL, and conducting finite element temperature analysis on the model, (3) conducting function fitting on the temperature distribution of the device in
MATLAB, and (4) substituting the
power consumption, the area of a heating zone, the ambient temperature and other arguments of the actual active device into a
temperature function expression formula, and obtaining the temperature distribution of the device. The method for predicting temperature distribution of a
semiconductor device can be widely applied to the field of
integrated circuit analysis, and compared with the traditional finite
element analysis method, the method for predicting temperature distribution of a
semiconductor device has the advantages of omitting the processes of
entity model establishment and
mesh generation and saving plenty of
computer hardware resources and calculation time, and the method for predicting temperature distribution of a
semiconductor device can achieve the temperature analysis of the
semiconductor device simply, quickly and efficiently.