The invention discloses a method for predicting temperature distribution of a 
semiconductor device, and relates to the technical field of 
integrated circuit analysis. The method comprises the main steps of (1) acquiring 
model parameters of the active device from a 
chip, (2) establishing a model of the device in COMSOL, and conducting finite element temperature analysis on the model, (3) conducting function fitting on the temperature distribution of the device in 
MATLAB, and (4) substituting the 
power consumption, the area of a heating zone, the ambient temperature and other arguments of the actual active device into a 
temperature function expression formula, and obtaining the temperature distribution of the device. The method for predicting temperature distribution of a 
semiconductor device can be widely applied to the field of 
integrated circuit analysis, and compared with the traditional finite 
element analysis method, the method for predicting temperature distribution of a 
semiconductor device has the advantages of omitting the processes of 
entity model establishment and 
mesh generation and saving plenty of 
computer hardware resources and calculation time, and the method for predicting temperature distribution of a 
semiconductor device can achieve the temperature analysis of the 
semiconductor device simply, quickly and efficiently.