System and method of grinding wafer by utilizing magnetic field and laser
A wafer and laser technology, applied in the direction of laser welding equipment, manufacturing tools, welding equipment, etc., to achieve the effect of improving precision, high precision and high efficiency
Inactive Publication Date: 2017-10-17
WUHAN UNIV
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Problems solved by technology
[0005] In order to solve the above-mentioned technical problems, the present invention provides a system and method for spot-grinding wafers with femtosecond lasers after surface-grinding wafers with magnetic nanoparticles in the grinding liquid controlled by a magnetic field. The process cannot realize the problem of combining high-efficiency surface processing with nanometer-resolution high-precision point processing
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[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0020] please see figure 1 , a system for grinding a wafer by using a magnetic field and a laser provided by the present invention includes a femtosecond laser generator 11, a robotic arm 12, a 3D imaging module 13, a wafer 14, an operating platform 15, a magnetic field generator 17, a grinding Liquid chamber 18; the grinding liquid chamber 18 is fixedly arranged on the operation platform 15, and the wafer 14 is fixedly arranged in the grinding liquid chamber ...
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Abstract
The invention discloses a system and method for grinding a wafer by utilizing a magnetic field and a laser. The system comprises a femtosecond laser generator, a machine arm, a 3D imaging module, the wafer, an operating platform, a magnetic field generator, and a grinding liquid cavity; the grinding liquid cavity is fixedly formed in the operating platform, the wafer is fixedly arranged in the grinding liquid cavity, and the grinding liquid cavity is filled with a grinding fluid; the femtosecond laser generator and the magnetic field generator are both fixedly arranged on the machine arm; the 3D imaging module is used for acquiring the surface topography of the wafer and establishing a 3D model to calculate the coordinates of the surface material part to be removed. According to the method, the wafer is subjected to point grinding by utilizing the femtosecond laser after the wafer is subjected to face grinding by utilizing the magnetic field to control the magnetic nanoparticles in the grinding liquid, and the method has the advantages of being high in efficiency and high in precision.
Description
technical field [0001] The invention belongs to the technical field of wafer grinding, and provides a system and a method for surface grinding a wafer by using a magnetic field to control magnetic nanoparticles in a grinding liquid, and then using a femtosecond laser to spot grind the wafer. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer; it can be processed into various circuit element structures on the silicon wafer, and become an IC with specific electrical functions. product. The raw material of the wafer is silicon, and the surface of the earth's crust has an inexhaustible amount of silicon dioxide. Silica ore is refined in an electric arc furnace, chlorinated with hydrochloric acid, and distilled to produce high-purity polysilicon. After photolithography, grinding, polishing, slicing and other procedures, the polycrystalline silico...
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IPC IPC(8): B24B1/00B23K26/36
CPCB24B1/005B23K26/36
Inventor 刘胜苏丹占必红程佳瑞王春喜
Owner WUHAN UNIV