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Thin-film capacitor with heat dissipation structure

A film capacitor and heat dissipation structure technology, applied in the field of capacitors, can solve the problems of life decay, thermal breakdown, and changes in the electrical properties of capacitors, and achieve the effect of promoting emission and preventing excessive temperature

Inactive Publication Date: 2017-10-20
铜陵市胜美达电子制造有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This causes a change in the electrical properties of the capacitor
Moreover, long-term heating will lead to the aging of the film medium, the life attenuation, and in severe cases, it will appear as thermal breakdown

Method used

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  • Thin-film capacitor with heat dissipation structure

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Embodiment Construction

[0017] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0018] A film capacitor with a heat dissipation structure, comprising a shell 1, a base 2 and a core 3, the core 3 is wound and arranged on a mandrel 4, the core 3 is formed by winding a base film, and the base film is provided with There is a metal layer and a margin, and the end of the margin away from the metal layer is provided with a metalliz...

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Abstract

The invention provides a thin-film capacitor with a heat dissipation structure, which comprises a shell, a base and a core, and is characterized in that the core is wound on a core rod, the lower end of the integrated core and core rod is provided with a lining plate, and the integrated core and core rod and the lining plate are arranged in the shell together, the lower end of the shell is provided with the base, the upper end of the shell is provided with a fixing cover, the core is provided with a wire, a gap between the core and the shell is filled with fixing glue, the lining plate is fixedly provided with electrodes, one end of each electrode is connected with the core through a wire, and the electrodes penetrate through the base. The thin-film capacitor is provided with a specific heat dissipation structure on a base film so as to enable air or water vapor remained in the film to be discharged quickly, epoxy resin of the core is filled with a heat-conducting insulating material so as to enable the epoxy resin to form a heat conducting path therein, heat generated in the using process of the capacitor is promoted to be dissipated into the environment, and a circumstance that the capacitor declines in electrical performance or even is out of operation because of an overhigh temperature in the using process is effectively prevented.

Description

technical field [0001] The invention relates to the technical field of capacitors, in particular to a film capacitor with a heat dissipation structure. Background technique [0002] During the use of film capacitors, due to the existence of electrode resistance and dielectric loss (ie equivalent series resistance), the capacitor will generate heat. A part of the heat generated by a general capacitor will be dissipated into the surrounding environment, and part of it will cause the internal heating of the capacitor. This causes a change in the electrical properties of the capacitor. Moreover, long-term heating will lead to the aging of the film medium, the life attenuation, and in severe cases, it will appear as thermal breakdown. Contents of the invention [0003] (1) Solved technical problems [0004] Aiming at the deficiencies of the prior art, the present invention provides a thin film capacitor with a heat dissipation structure, which overcomes the deficiencies of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G2/08H01G4/224H01G4/32H01G4/33
CPCH01G4/33H01G2/08H01G4/224H01G4/32
Inventor 夏斌
Owner 铜陵市胜美达电子制造有限公司
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