The invention discloses a 
silicon bar 
cutting technology. The 
silicon bar 
cutting technology comprises the following steps that firstly, 
silicon bar square forming is conducted, and a center silicon block and four edge materials which extend in the same direction with a silicon bar are 
cut; the four edge materials are 
cut into a first small silicon block, a second small silicon block and a third small silicon block which extend in the same direction with the silicon bar; the length of the cross sections of the first small silicon block and the third small silicon block is 1 / 2 of the width of the cross section of the center silicon block; the length of the cross section of the second small silicon block is the same with the width of the cross section of the center silicon block; and slicingis conducted on the center silicon block, the first small silicon block, the second small silicon block and the third small silicon block, and the 
slicing direction is parallel to the silicon bar extending direction. The 
slicing direction is parallel to the silicon bar extending direction, and therefore the length size of a silicon 
wafer obtained through 
slicing cannot be limited by the diameterof the silicon bar, and a rectangular silicon 
wafer with the large length size is easily prepared; and by means of the silicon bar 
cutting technology, two kinds of silicon wafers different in width specification can be 
cut, the silicon bar 
utilization rate can be increased, and the silicon 
wafer production cost is reduced.