Silicon rod cutting process

Abstract

The invention discloses a silicon rod cutting process, comprising the following steps: square the silicon rod, and cut out: a central silicon block and four side skins extending in the same direction as the silicon rod; The silicon rods extend in the same direction: the first small silicon block, the second small silicon block and the third small silicon block; the cross-sectional length of the first small silicon block and the third small silicon block is half of the cross-sectional width of the central silicon block One; the cross-sectional length of the second small silicon block is the same as the cross-sectional width of the central silicon block; the central silicon block, the first small silicon block, the second small silicon block, and the third small silicon block are sliced, and the slicing direction is the same as that of the silicon rod The direction of extension is parallel. The slicing direction of the present invention is parallel to the extension direction of the silicon rod, so the length and dimension of the obtained silicon wafer can not be limited by the diameter of the silicon rod, and it is easy to prepare a rectangular silicon wafer with a large length and size, and the present invention can cut out two kinds of width specifications of the silicon wafer. Chips can improve the utilization rate of silicon rods and reduce the production cost of silicon wafers.

Description

technical field [0001] The present invention relates to a silicon rod cutting process. Background technique [0002] Monocrystalline silicon wafers for solar cells are generally cut from silicon rods. Specifically, generally, a silicon rod (ie, a round rod) is first squared, and a silicon block (ie, a square rod or a quasi-square rod) is cut, and then the silicon block is sliced ​​to cut a silicon wafer. [0003] The overall shape of the silicon wafer is generally rectangular, but in the existing silicon rod cutting process, the slicing direction is perpendicular to the extension direction of the silicon block, that is, the slicing direction is perpendicular to the extension direction of the silicon rod, so the length and width of the silicon wafer are affected by the silicon rod. diameter limit. If a rectangular silicon wafer with a larger length is to be prepared, a silicon rod with a larger diameter must be prepared in advance, which increases the technological difficul...

AI Technical Summary

Problems solved by technology

[0003] The overall shape of the silicon wafer is generally rectangular, but in the existing silicon rod cutting process, the slicing direction is perpendicular to the extending direction of the silicon block, that is, the slicing direction is perpendicular to the extending direction of the silicon rod, so the length and width of the silicon wafer are all affected by the silicon rod. diameter limit

If a rectangular silicon wafer with a larger length and size is to be prepared, a silicon rod with a larger diameter must be prepared in advance, which increases the difficulty and cost of the silicon rod preparation process

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