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Far-infrared composite resin heating substrate, and fabrication method and application thereof

A composite resin, far-infrared technology, used in electric heating devices, ohmic resistance heating, electrical components and other directions, can solve the problem of not being able to provide far-infrared heating substrates, etc., to achieve benefits for human health, uniform surface temperature, electrical stability and durability. good performance

Active Publication Date: 2017-10-20
东莞市宏阳热能科技有限公司
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  • Abstract
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  • Claims
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Problems solved by technology

[0003] The purpose of the present invention is to provide a far-infrared composite resin heating substrate and its preparation method, aiming to solve the problem that the prior art cannot provide a far-infrared heating substrate containing composite resin

Method used

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  • Far-infrared composite resin heating substrate, and fabrication method and application thereof
  • Far-infrared composite resin heating substrate, and fabrication method and application thereof
  • Far-infrared composite resin heating substrate, and fabrication method and application thereof

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Embodiment Construction

[0025] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0026] to combine figure 1 , figure 2 , the embodiment of the present invention provides a far-infrared composite resin heating substrate, including a first composite resin substrate 1, a metal conductive foil chip layer 2, an inorganic non-metallic far-infrared resistance layer 3 that releases far-infrared rays, and a second Composite resin substrate 4, wherein the metal conductive foil chip layer 2 includes a reflective aluminum foil 21, a first insulating layer 221, a geometric shape resistance chip 222 and a second insulating layer sequentially arranged on the first composite resin su...

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Abstract

The invention provides a far-infrared composite resin heating substrate, which comprises a first composite resin substrate, a metal conductive foil chip layer, an inorganic non-metallic far-infrared resistance layer releasing far infrared rays and a second composite resin substrate which are sequentially arranged, wherein the metal conductive foil chip layer comprises reflective aluminum foil, a first insulation layer, a geometrical resistor chip and a second insulation layer disposed in sequence on the first composite resin substrate, and the inorganic non-metallic far-infrared resistance layer releasing the far infrared rays includes a substrate and an inorganic non-metallic far-infrared graphite resistive film releasing the far infrared rays and deposited on the substrate.

Description

technical field [0001] The invention belongs to the technical field of composite resin, and in particular relates to a far-infrared composite resin heating substrate, its preparation method and application. Background technique [0002] The electronics and electrical appliances industry is a high-tech industry that has developed rapidly in the past 30 years. Electronic functional materials are the foundation and support of electronic components and electronic equipment, and are widely used in various fields of the electronics industry. With the rapid progress of electronic component manufacturing technology, electronic products are developing in the direction of small, light, thin, high-performance, multi-functional, and healthy, which in turn promotes the continuous progress of electronic materials. Composite resin materials have many excellent properties, such as high strength, good fatigue resistance, corrosion resistance, dimensional stability, low density, and unique ma...

Claims

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Application Information

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IPC IPC(8): H05B3/28
CPCH05B3/286Y02B30/00
Inventor 陶志斌居苏吕雅华周游
Owner 东莞市宏阳热能科技有限公司
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