Complexing agent used for chemical copper plating solution and preparation method of complexing agent

A technology of electroless copper plating and complexing agent, which is applied in the field of complexing agent for electroless copper plating solution and its preparation, which can solve the problems of affecting the bonding strength of the plating layer and the substrate, affecting the thickness of the activated copper layer of the bath, and achieving brittleness. Small, avoiding the effect of bonding strength and improving stability

Inactive Publication Date: 2017-10-27
南通赛可特电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented technology allows for easy-to-use high purity metal layers on various materials such as steel without causing cracks during manufacturing processes. It also results in improved adhesion between these metals compared to traditional methods like chemical vapor depositing (CVD).

Problems solved by technology

This patented technical problem addressed in this patents relates to controlling the amount of metal added during an immersion process for improving adhesion between layers on materials such as steel sheets when they are being galvanized with zinc-based coatings.

Method used

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  • Complexing agent used for chemical copper plating solution and preparation method of complexing agent

Examples

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Embodiment 1

[0010] Raw materials: potassium sodium tartrate 150kg, sodium hydroxide 180kg, additive nickel sulfate 20L, water 1000L.

[0011] The preparation method, the specific steps are as follows: 1) Add potassium sodium tartrate to water, stir and dissolve until clear, and control the temperature at 20-30°C; 2) Add sodium hydroxide, stir and dissolve until clear, and control the temperature below 70°C; 3) Add additive M, and control the temperature at 40-50°C.

Embodiment 2

[0013] Raw materials: potassium sodium tartrate 150 kg, sodium hydroxide 200 kg, additive nickel sulfate 30 L, water 1000 L.

[0014] The preparation method, the specific steps are as follows: 1) Add potassium sodium tartrate to water, stir and dissolve until clear, and control the temperature at 20-30°C; 2) Add sodium hydroxide, stir and dissolve until clear, and control the temperature below 70°C; 3) Add additive M, and control the temperature at 40-50°C.

Embodiment 3

[0016] Raw materials: potassium sodium tartrate 160 kg, sodium hydroxide 180 kg, additive nickel sulfate 20L, water 1000L.

[0017] The preparation method, the specific steps are as follows: 1) Add potassium sodium tartrate to water, stir and dissolve until clear, and control the temperature at 20-30°C; 2) Add sodium hydroxide, stir and dissolve until clear, and control the temperature below 70°C; 3) Add additive M, and control the temperature at 40-50°C.

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Abstract

The invention discloses a complexing agent used for chemical copper plating solution. The complexing agent comprises the following raw materials in parts by weight: 150-160 kg of seignette salt, 180-200kg of sodium hydroxide, 20-30L of an additive (nickel sulfate) and 1,000L of water. A preparation method of the complexing agent specifically comprises the following steps: 1) adding seignette salt into water, stirring and dissolving until the mixed solution is clear and controlling the temperature at 20-30 DEG C; 2) adding sodium hydroxide, stirring and dissolving until the mixed solution is clear and controlling the temperature at below 70 DEG C; 3) adding an additive M and controlling the temperature at 40-50 DEG C. The complexing agent has the advantages of being low in operation temperature and convenient in use, being capable of improving the stability of the copper plating solution and enabling the thickness of a prepared copper-plated layer to be moderate and stable.

Description

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Claims

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Application Information

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Owner 南通赛可特电子有限公司
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