Complexing agent used for chemical copper plating solution and preparation method of complexing agent
A technology of electroless copper plating and complexing agent, which is applied in the field of complexing agent for electroless copper plating solution and its preparation, which can solve the problems of affecting the bonding strength of the plating layer and the substrate, affecting the thickness of the activated copper layer of the bath, and achieving brittleness. Small, avoiding the effect of bonding strength and improving stability
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Embodiment 1
[0010] Raw materials: potassium sodium tartrate 150kg, sodium hydroxide 180kg, additive nickel sulfate 20L, water 1000L.
[0011] The preparation method, the specific steps are as follows: 1) Add potassium sodium tartrate to water, stir and dissolve until clear, and control the temperature at 20-30°C; 2) Add sodium hydroxide, stir and dissolve until clear, and control the temperature below 70°C; 3) Add additive M, and control the temperature at 40-50°C.
Embodiment 2
[0013] Raw materials: potassium sodium tartrate 150 kg, sodium hydroxide 200 kg, additive nickel sulfate 30 L, water 1000 L.
[0014] The preparation method, the specific steps are as follows: 1) Add potassium sodium tartrate to water, stir and dissolve until clear, and control the temperature at 20-30°C; 2) Add sodium hydroxide, stir and dissolve until clear, and control the temperature below 70°C; 3) Add additive M, and control the temperature at 40-50°C.
Embodiment 3
[0016] Raw materials: potassium sodium tartrate 160 kg, sodium hydroxide 180 kg, additive nickel sulfate 20L, water 1000L.
[0017] The preparation method, the specific steps are as follows: 1) Add potassium sodium tartrate to water, stir and dissolve until clear, and control the temperature at 20-30°C; 2) Add sodium hydroxide, stir and dissolve until clear, and control the temperature below 70°C; 3) Add additive M, and control the temperature at 40-50°C.
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