FOG bonding process method
A process method and fixed technology, applied in nonlinear optics, instruments, optics, etc., can solve the problems of non-display, display, electrode corrosion, etc., and achieve the effect of preventing corrosion effects, improving process level, and preventing corrosion pollution.
Inactive Publication Date: 2017-11-03
重庆市福显电子科技有限公司
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Problems solved by technology
[0008] In view of the existing FOG bonding LCM products, the FOG electrode surface of the liquid crystal display is prone to electrode corrosion, which is likely to cause a short circuit with the adjacent electrode so that both itself and the adjacent graphics are displayed or not displayed. After research and analysis, the inventor of the application found that the root cause of the electrode corrosion at the ITO terminal of the liquid crystal glass connected to the FPC was caused by pollutants. Therefore, before the FOG bonding, the liquid crystal display must be cleaned again. This invention provides A new FOG bonding process method was developed to solve the electrode corrosion phenomenon on the surface of FOG electrodes
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[0032] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific illustrations.
[0033] In describing the present invention, it is to be understood that the terms "longitudinal", "radial", "length", "width", "thickness", "upper", "lower", "front", "rear", The orientation or positional relationship indicated by "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings , is only for the convenience of describing the present invention and simplifying the description, but does not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. In the description of the present inventi...
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The invention provides a FOG bonding process method. The method comprises the following steps: scrubbing the ITO terminal face of liquid crystal glass to be subjected to press fit along the same direction by using acetone; placing the scrubbed liquid crystal glass in a container loaded with isopropyl-ketone and sealing, and washing in an ultrasonic cleaning machine; taking out the liquid crystal glass and washing by using deionized water, and drying the washed liquid crystal glass by using a drier; directly adhering an anisotropy conductive adhesive at the ITO terminal of the dried liquid crystal glass, and pre-heating a pressure head of a FOG bonding machine; aligning a to-be-bonded pin of FPC to be bonded with a pin of the liquid crystal glass, and pre-bonding the pre-heated pressure head to form initial connection; and heating and pressurizing the pressure head so that conducting particles in the anisotropy conductive adhesive are elastically deformed and an insulating layer is fractured, pressing the FPC on the liquid crystal glass, and finishing the main bonding processing of the FPC and the liquid crystal glass. The method is capable of effectively preventing the corrosion pollution of a contaminant to an electrode of the ITO terminal, and improving the FOG bonding process level.
Description
technical field [0001] The invention relates to the technical field of liquid crystal display modules, in particular to a FOG bonding process method. Background technique [0002] LCM (Liquid Display Module, liquid crystal display module) is a component that assembles liquid crystal display screen, driving circuit, FPC (Flexible Printed Circuit, flexible printed circuit board), backlight and other structural components. The mechanical connection and electrical conduction between the liquid crystal glass and the drive circuit and FPC in the liquid crystal display are the core parts of LCM production. It is mounted on a glass panel; in the FOG bonding process, ACF (Anisotropic Conductive Film) material will be used. [0003] The traditional FOG bonding process mainly includes the following three steps: [0004] 1) ACF pre-pasting: Paste the ACF of the specified length on the ITO terminal of the LCD glass or the pin of the FPC that needs to be bonded; [0005] 2) Pre-bonding...
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IPC IPC(8): G02F1/13G02F1/1333
CPCG02F1/1303G02F1/1333
Inventor 潘兴文
Owner 重庆市福显电子科技有限公司