Heat dissipation method suitable for automobile electronic water pump power device

Abstract

The invention discloses a heat dissipation method suitable for an automobile electronic water pump power device. The power device is in brazed connection with the upper surface of a glass fiber cloth-based printed circuit board; the lower surface of the glass fiber cloth-based printed circuit board is in brazed connection with the upper surface of a metal-based printed circuit board; the back surface of the metal-based printed circuit board is coated with heat conducting silicon grease; and the metal-based printed circuit board is connected to a motor shell through a screw or an elastic buckle. The heat dissipation method for the power device achieves the technical effects of low cost, high design flexibility and low thermal resistance of the power device.

Description

technical field [0001] The invention relates to the field of heat dissipation of electronic devices, in particular to a heat dissipation method suitable for power devices of automotive electronic water pumps. Background technique [0002] With the gradual popularization of electric vehicles or hybrid vehicles, electronic water pumps are also used on a large scale. Compared with the traditional water pump, the electronic water pump adds an electronic controller. Electronic water pump controllers are equipped with power semiconductors. The reliability of power semiconductors such as MOSFETs and IGBTs decreases as the junction temperature of the IC rises. If the junction temperature exceeds 175°C, irreversible damage will occur. The heat dissipation environment of the power devices on the controller is relatively poor, such as the working environment temperature of the car in summer, the heating of the motor (generally, the electronic water pump controller is installed inside ...

AI Technical Summary

Problems solved by technology

[0006] The invention provides a heat dissipation method suitable for power devices of automotive electronic water pumps, which solves the problems of high cost, easy breakage of substrates, poor heat dissipation performance or low density and high difficulty in designing circuits in existing automotive electronic water pump power devices. That is, the technical problem of poor comprehensive performance realizes the technical effects of low manufacturing cost, high design flexibility, and low thermal resistance of power devices.

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