A chip cleaning container

Abstract

The invention discloses a chip cleaning container which comprises an accommodating chamber, wherein the accommodating chamber is provided with a hole seam into which a chip clamping holder can extend; a side wall of the accommodating chamber is provided with a number of hole seams extending from the hole seam to a bottom part, and the chip clamping holder can pass through the hole seams. When a chip is clamped from the accommodating chamber via the chip clamping holder by a worker, the chip can be clamped via the chip clamping holder, the chip is positioned above an opening of the accommodating chamber, an azimuth of the chip clamping holder is adjusted, a chip clamping holder body is enabled to run through one hole seam arranged on the side wall of the accommodating chamber, the chip clamping holder is gradually put down along the hole seam so as to be tightly adhered to a surface of the bottom part of the accommodating chamber, the chip can be softly and stably placed on the surface of the bottom part of the accommodating chamber when the chip clamping holder is loosened, an end part of the chip can be prevented from clashing the bottom part of the accommodating chamber, the chip can be effectively prevented from falling and being fragmented, and economic loss can be lowered.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a chip cleaning container. Background technique [0002] With the development of China's semiconductor industry, more and more semiconductor devices have been widely used. [0003] A semiconductor device is an electronic device whose conductivity is between a good conductor and an insulator. It uses the special electrical characteristics of semiconductor materials to complete specific functions. Using different semiconductor materials, different processes and geometric structures, a wide variety of functions have been developed. A variety of crystal diodes with different uses can be used to generate, control, receive, transform, amplify signals and perform energy conversion. The frequency coverage of crystal diodes can range from low frequency, high frequency, microwave, millimeter wave, infrared to light wave. Three-terminal devices are generally active devices, typical...

AI Technical Summary

Problems solved by technology

However, due to the deepness of the cleaning flower basket in the prior art, in the process of placing the chip, it is necessary to clamp the chip with tweezers, and then obliquely extend into the cleaning flower basket. When one end of the chip touches the bottom of the cleaning flower basket, the tweezers will loosen. Open, so that the chips fall freely into the flower basket

However, since the chip is very thin during the manufacturing process, the strength is not enough, and it is relatively brittle, the cleaning flower basket in the prior art is very easy to cause cracks on the chip due to the impact stress generated by the drop during the process of placing the chip, or even fragmentation, causing economic loss

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