Method for manufacturing chip-mounting substrate, and chip-mounting substrate

A chip mounting and substrate technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve the problems of difficult to manufacture masks, reduce the precision of planar masks, and separate masks, etc., and achieve improved The effect of reducing bonding force and manufacturing cost

Active Publication Date: 2017-11-24
POINT ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] However, in the method of using a mask in this way, there is a problem that a separate mask is required
Further, when the bump 130 is formed on the metal substrate having the cavity 140,

Method used

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  • Method for manufacturing chip-mounting substrate, and chip-mounting substrate
  • Method for manufacturing chip-mounting substrate, and chip-mounting substrate
  • Method for manufacturing chip-mounting substrate, and chip-mounting substrate

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[0044] The embodiments of the present invention will now be described in detail with reference to the drawings.

[0045] For the structure of the present invention that is the same as the prior art, refer to the prior art. The detailed description will be omitted.

[0046] reference Figure 4 , The method for manufacturing a chip mounting substrate according to an embodiment of the present invention includes: a pre-coating step of forming a pre-coating layer 60 on the metal substrate 10 divided into two conductive parts through an insulating part 20; and using a laser (not shown) ) An etching step of etching at least a part of the precoat layer 60 to form a pattern 50; and a step of forming a metal layer 30 on the metal substrate 10, wherein the pattern 50 is provided on at least one of the two conductive portions divided by the insulating portion 20 , And the metal layer 30 is formed in the pattern 50.

[0047] The method of this embodiment may further include a cavity forming ste...

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Abstract

A method for manufacturing a chip-mounting substrate includes a pre-coating step of forming a precoat on a substrate including a plurality of conductive portions and an insulating portion interposed between the conductive portions, an etching step of etching at least a portion of the precoat through a laser to form a pattern, and a step of forming a metal layer on the substrate. The pattern is disposed on at least one of the conductive portions, and the metal layer is formed in the pattern.

Description

technical field [0001] The present invention relates to a method for manufacturing a chip mounting substrate, and more particularly, to a method for manufacturing a chip mounting substrate, the method including an etching step and a step of forming a metal layer in a pattern, the etching step is performed by a laser At least a portion of the precoat is etched to form a pattern. Background technique [0002] In general, light emitting diodes (LEDs), which are semiconductor light emitting diodes, are environmentally friendly light sources that do not cause pollution. Light-emitting diodes have drawn attention from all sides. In recent years, as the use of LEDs has expanded to various fields such as indoor / outdoor lighting, automotive headlights, and backlight units (BLUs) of display devices, high luminous efficiency and excellent heat dissipation characteristics have been required to be achieved. In order to obtain high-efficiency LEDs, it is necessary to mainly improve the ...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/62
CPCH01L33/486H01L33/62H01L2933/0066H01L21/481H01L21/4846H01L33/46H01L33/60H01L2224/81385H01L2224/83385H01L2224/83439H01L2224/85439H01L23/498H01L23/00H01L2924/15153H01L33/005H01L33/02H01L33/22H01L33/44H01L2924/12041H01L2933/0025H01L2933/0033
Inventor 安范模朴胜浩宋台焕
Owner POINT ENG
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