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A stamping die for a flexible circuit board

A technology of flexible circuit boards and stamping dies, applied in the direction of manufacturing tools, safety equipment, feeding devices, etc., can solve problems such as easy drop and damage, low work efficiency, troublesome operation of flexible circuit boards, etc., to reduce noise and avoid Effects of manual cleaning, improved safety and work efficiency

Active Publication Date: 2019-01-18
永盛恒基(惠州)电路板有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing stamping dies have structural deficiencies, which lead to troublesome operation when the flexible circuit board is taken out after punching, easy to drop and damage, and low work efficiency.

Method used

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  • A stamping die for a flexible circuit board
  • A stamping die for a flexible circuit board
  • A stamping die for a flexible circuit board

Examples

Experimental program
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Effect test

Embodiment approach

[0034] As an embodiment of the present invention, the air inlet of the two-way pump is connected with moist air, and the moist air is used to improve the sealing performance of the No. 1 buffer suction cup 16 and the No. 2 buffer suction cup 17 .

[0035] As an embodiment of the present invention, the elastic member 9 is one of a spring or an elastic airbag. The spring has a simple structure, low price and is easy to obtain; the elastic airbag has low noise, adjustable elastic force and good use effect.

[0036] As an embodiment of the present invention, the friction force between the damping member 10 and the guide rod 3 is adjustable, and by adjusting the friction force between the damping member 10 and the guide rod 3, the middle mold base 5 can be adjusted to be elastically The moving distance after the part 9 is ejected, so that the punched flexible circuit board 13 can be accurately left in the parts box 111.

[0037] As an embodiment of the present invention, the contro...

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PUM

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Abstract

The invention belongs to the field of punching of flexible circuit boards, and particularly relates to a stamping die for a flexible circuit board. The stamping die comprises a left fixed base, a right fixed base, guide rods, a left die holder, a middle die holder, a right die holder, a first electromagnet, a second electromagnet, elastic pieces, damping pieces, a material storage box, a control switch and a controller. The left fixed base and the right fixed base are fixedly arranged in a left-right opposite manner. The guide rods are fixed between the left fixed base and the right fixed base. The left die holder, the middle die holder and the right die holder are sequentially installed on the guide rods from left to right. The first electromagnet and the second electromagnet are installed on the left fixed base and the right fixed base correspondingly. The elastic pieces are arranged on the guide rods in a sleeving manner. The damping pieces are installed on the middle die holder. The material storage box is located below the middle die holder. The control switch is used for controlling the first electromagnet and the second electromagnet to be powered on. Punching of the flexible circuit board is achieved by alternately attracting the middle die holder through alternate electric conduction of the first electromagnet and the second electromagnet, and the stamping die has the beneficial effects of being small in size and small in weight.

Description

technical field [0001] The invention belongs to the field of punching and cutting of flexible circuit boards, in particular to a stamping die for flexible circuit boards. Background technique [0002] Flexible printed circuit board (FlexiblePrintedCircuitBoard, referred to as FPC or flexible circuit board) is a printed circuit made of flexible insulating substrates. It has many advantages that rigid printed circuit boards do not have. According to the requirements of space layout, it can be arranged arbitrarily, and can be moved and stretched arbitrarily in three-dimensional space, so as to achieve the integration of component assembly and wire connection. The use of FPC can greatly reduce the volume of electronic products, which is suitable for the development of electronic products in the direction of high density, miniaturization and high reliability. [0003] With the rapid development of the international and domestic electronics industry, especially the continuous dev...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B21D28/14B21D43/18B21D55/00B26F1/44B26D7/06B26D7/22
CPCB21D28/14B21D43/18B21D55/00B26D7/06B26D7/22B26F1/44
Inventor 林春芳苏杰夏巧巧冯婷婷
Owner 永盛恒基(惠州)电路板有限公司