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A self-monitoring method of built-in chip health status for integrated microsystems

A technology of health status and micro-system, applied in the direction of measuring electricity, measuring devices, measuring electrical variables, etc., can solve the problem of inability to monitor its own health status, and achieve improved integration and independence, low power consumption control, and large dynamic range. Effect

Active Publication Date: 2019-07-23
BEIJING MXTRONICS CORP +1
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a self-monitoring method for the health state of the built-in chip oriented to the integrated microsystem. Detection of the health status of each functional module of the integrated microsystem

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  • A self-monitoring method of built-in chip health status for integrated microsystems
  • A self-monitoring method of built-in chip health status for integrated microsystems
  • A self-monitoring method of built-in chip health status for integrated microsystems

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Embodiment Construction

[0037] Integrated microsystem usually has clock circuit part (including AD clock circuit, processor clock circuit), 3101 processor, status display (GPIO circuit) and communication circuit (UART chip), storage circuit (including SRAM chip, SDRAM chip, FLASH chip ); 3101 processor includes SRAM controller, SDRAM controller, FLASH controller, FLASH controller, AD acquisition circuit.

[0038] The present invention adds a voltage acquisition circuit part, a current acquisition part, and a real-time clock circuit on the basis of the existing framework of the integrated microsystem, and embeds a health processing submodule in the 3101 processor to process health state information. The voltage acquisition part collects the operating voltage state of the integrated system. The 3.3V and 1.8V voltages of the system are collected, and the corresponding output terminals are connected to the AD_IN_3 and AD_IN_4 terminals of the SPARC V8 processor; the current collection part collects the o...

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Abstract

The invention relates to a built-in chip health state self monitoring method for an integrated microsystem. The integrated microsystem is internally provided with a voltage acquisition circuit, a current acquisition circuit and a real-time clock circuit. The integrated microsystem comprises a processor, a state display circuit, a communication circuit and a storage circuit. The acquired power voltage and the acquired working current are subjected to health analysis, if the data are in a correct threshold range, correct information recording is carried out in a state marking array, and the operation time is recorded. If the data are not in the correct threshold range, a mistake is indicated, and wrong information recording is carried out in the state marking array. The state display circuit is driven to display. The health state self detection method is built inside the integrated microsystem, after the integrated microsystem is installed, electrical characteristics can still be detected, analysis and prediction on the self health state can be realized, and the problem that after the integrated microsystem is applied, the working current can not be tested accurately can be solved.

Description

technical field [0001] The invention relates to a method for self-monitoring the health state of a built-in chip facing an integrated microsystem, and belongs to the technical field of online monitoring. Background technique [0002] The system formed by integrating digital circuits, MEMS, optoelectronics and other devices in a chip-level volume using heterogeneous integration technology is a chip-level integrated microsystem, referred to as an integrated microsystem. [0003] With the rapid development of the miniaturization of satellites and launch vehicles, the demand for miniaturization and low power consumption of their electronic systems is becoming more and more obvious. As a new model of flat design, the integrated microsystem integrates functional units such as information perception, data processing, and drive control into a chip-sized package using MCM, SIP, and TSV packaging technologies, which greatly improves system integration. Spend. [0004] In the design ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/317G01R19/25
CPCG01R19/2509G01R31/31702G01R31/31704G01R31/31726
Inventor 任永正陆振林荣金叶焦烨韩逸飞王建永祝长民李楠王枭鸿李璟
Owner BEIJING MXTRONICS CORP
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