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Semiconductor package and manufacturing method of semiconductor package

A manufacturing method and semiconductor technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as scribing knife wear and achieve the effect of reducing maintenance frequency

Inactive Publication Date: 2017-12-01
AMKOR TECH JAPAN INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When dividing semiconductor packages, if a dicing knife is used to process each metal substrate, the dicing knife will wear out and must be replaced in a short period of time

Method used

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  • Semiconductor package and manufacturing method of semiconductor package
  • Semiconductor package and manufacturing method of semiconductor package
  • Semiconductor package and manufacturing method of semiconductor package

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0058] refer to figure 1 , the outline of the semiconductor package according to Embodiment 1 of the present invention will be described in detail. figure 1 It is a schematic cross-sectional view of a semiconductor package according to one embodiment of the present invention.

[0059] (Structure of semiconductor package 10)

[0060] Such as figure 1 As shown, the semiconductor package 10 has a supporting substrate 100 , an adhesive layer 110 , a semiconductor device 120 , a first resin insulating layer 130 , wiring 140 , a second resin insulating layer 150 and solder balls 160 .

[0061] The support base 100 has a first surface 302 on which the semiconductor device 120 is disposed, a second surface 304 opposite to the first surface, and a side surface 310 between the first surface 302 and the second surface 304 . The first face 302 has a first end 306 at its end and the second face 304 has a second end 308 at its end. The side surface 310 is a surface connecting the first ...

Embodiment approach 2

[0118] refer to Figure 24 , the outline of the semiconductor package according to Embodiment 2 of the present invention will be described in detail. Figure 24 It is a schematic cross-sectional view of a semiconductor package according to one embodiment of the present invention.

[0119] (Structure of semiconductor package 20)

[0120] The semiconductor package 20 of the second embodiment is similar to the semiconductor package 10 of the first embodiment, but differs from the semiconductor package 10 in that the alignment mark 114 is realized by the opening provided in the adhesive layer 110 . In the semiconductor package 20 , no concave portion is formed in the support base 100 . However, similarly to the semiconductor package 10 , a concave portion may be provided on the first surface 302 of the support base 100 of the semiconductor package 20 and an auxiliary alignment mark may be formed. Since other components of the semiconductor package 20 are the same as those of th...

Embodiment

[0131] Hereinafter, the observation result of the optical microscope image of the Example which shows the manufacturing method of the semiconductor package concerning embodiment of this invention is demonstrated. Specifically, as Figure 22 and Figure 23 As shown, a sample separated by the manufacturing method of the embodiment of the present invention and a sample separated by the manufacturing method of the comparative example were compared.

[0132] Figure 30A and Figure 30B It is a diagram showing an optical microscope image comparing the side shape of the support base material in one example of the present invention with the side shape of the support base material in the comparative example. Figure 30A Part (a) of the embodiment is carried out through two steps of scribing of the resin insulating layer (adhesive layer 110, first resin insulating layer 130 and second resin insulating layer 150) and laser irradiation of the supporting substrate 100. Optical microsco...

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PUM

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Abstract

A manufacturing method of a semiconductor package includes locating a plurality of semiconductor packages on a substrate, forming a resin insulating layer covering the plurality of semiconductor devices, forming grooves, in the resin insulating layer, enclosing each of the plurality of semiconductor devices and reaching the substrate, and irradiating the substrate with laser light in positional correspondence with the grooves to separate the plurality of semiconductor devices from each other.

Description

technical field [0001] The present invention relates to a semiconductor package and a method for manufacturing the semiconductor package. In particular, the present invention relates to a semiconductor device mounting technique on a substrate. Alternatively, the present invention relates to the shape of an end portion of a substrate on which a semiconductor device is mounted. Background technique [0002] Conventionally, a semiconductor package structure in which a semiconductor device such as an integrated circuit (IC) chip is mounted on a support substrate has been used in electronic devices such as mobile phones and smartphones (for example, Japanese Patent Application Laid-Open No. 2010-278334). In such a semiconductor package, the following structure is generally adopted: a semiconductor device such as an IC chip or a memory is bonded to a support base material through an adhesive layer, and the semiconductor device is covered with a sealing body (resin material for se...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/28H01L23/12H01L23/13H01L21/78
CPCH01L21/78H01L23/12H01L23/13H01L23/28H01L21/561H01L23/3128H01L23/544H01L24/19H01L24/20H01L24/83H01L24/97H01L2223/54426H01L2223/54486H01L2224/04105H01L2224/12105H01L2224/2919H01L2224/32225H01L2224/32245H01L2224/73267H01L2224/8201H01L2224/82031H01L2224/82039H01L2224/83132H01L2224/83192H01L2224/92244H01L2224/97H01L2924/14H01L2924/1432H01L2924/1434H01L2924/1461H01L2924/3025H01L2224/83H01L21/268H01L21/52H01L23/522H01L24/27H01L24/28H01L21/56H01L21/82H01L23/3107H01L24/17H01L2924/182
Inventor 丸谷尚一甲斐稔北野一彦
Owner AMKOR TECH JAPAN INC
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