Chip packaging flipping LED white light chip preparation method
A chip-level packaging and flip-chip technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of increased process instability factors, unsuitable for chip-level packaging, and unsuitable for mass production, etc., to avoid Glue mixing and dispensing process, flip-chip LED packaging structure is simple, the effect of lower yield
Active Publication Date: 2017-12-15
NINGBO LONGER LIGHTING
View PDF7 Cites 6 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Some people have tried to use fluorescent film for chip-level packaging of flip chips: Xiong Yi of Guangzhou Hongli Optoelectronics Co., Ltd. has developed a chip-level packaging method ("chip-level packaging LED molding method and chip-level packaging LED", Patent application number: 201511013222.8), although this method achieves the effect of chip-level packaging, the process is complicated, and the bonding process of the package body on the chip is rough and unstable
Zheng Min of Xiamen Zhongxinda Industry and Trade Co., Ltd. has developed a chip-level packaging method for front-mounted chips ("Front-mounted chip-level white LED filament light source and its packaging method", patent application number: 20161072532.7), also using the bonding method However, the front-mount chip has a great disadvantage compared to the flip-chip performance, and the packaging is also very troublesome, so it is not suitable for making chip-level packaging.
Tianjin Degao Chemicals New Materials Co., Ltd. Tan Xiaohua and others used the method of lamination to prepare thin films (preparation method of chip-level packaged flip-chip LED white light chips, patent application number: 201510245273.7), but a large number of curing tapes were used to make the process Increased instability
Not suitable for mass production
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0042] A method for preparing a chip-scale packaged flip-chip LED white light chip proposed by the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that the drawings are all in a very simplified form and use imprecise ratios, which are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.
[0043] see figure 1 , figure 2 , image 3 A method for preparing a chip-level packaged flip-chip LED white light chip, comprising a pressing process, a curing process, a cutting process, and a detection process, specifically comprising the following steps:
[0044] S1: Arranging and placing the flip chips 2 on the die-bonding steel plate 3;
[0045] In this embodiment, the die-bonding process of the LED chip with the flip-...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The present invention discloses a chip packaging flipping LED white light chip preparation method. The method comprises a pressing process, a solidification process, a cutting process and a detection process. The preparation method avoids phosphor sedimentation, so that the flipping LED white light chip is high in batch stability and consistent in color temperature and the preparation method can control the thickness of the upper surface packaging film and the thickness of the side packaging film to regulate the light performances such as uniformity of luminance, color temperature and color rendering indexes, etc.
Description
technical field [0001] The invention relates to the field of LED chip preparation, in particular to a method for preparing a chip-level packaged flip-chip LED white light chip. Background technique [0002] Light Emitting Diode (Light Emitting Diode) light source, as a new type of green lighting source, has been widely used around the world for its characteristics of no pollution, long life, low loss, pure light color, and shock resistance. Chip-scale packaged LEDs have attracted wide attention due to their small package size, good heat dissipation performance, uniform light emission, and long life, and have become the industry's new favorite in recent years due to their high flexibility. [0003] Compared with fluorescent powder, fluorescent film has the advantages of high excitation and emission efficiency, thermal stability, mechanical strength, and simple packaging process. It is very suitable as a packaging body replacing filling glue and suitable for mass production. ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/50H01L33/48H01L21/78
CPCH01L21/78H01L33/48H01L33/505H01L2933/0033
Inventor 邹军姜楠石明明李杨杨波波李文博房永征
Owner NINGBO LONGER LIGHTING