A kind of LED filament preparation method based on chip-level packaging and self-tuning temperature adjustment
A technology of chip-level packaging and LED filaments, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems that there is no multi-color temperature chip to cooperate with light emission, optimize the structural performance, etc., to overcome poor stability, high excitation efficiency, The effect of high thermal conductivity
Active Publication Date: 2019-10-11
NINGBO LONGER LIGHTING
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Problems solved by technology
The current published literature and patents are all about the simple manufacturing process of LED filaments. The optimized structure and materials have not explained the performance, and there are no examples of multi-color temperature chips working together to emit light. We have made additional improvements to the above problems and prepared a chip-based Self-adjustable color temperature LED filament of level packaging flip chip
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[0030] A method for preparing an LED filament with self-adjustable temperature based on chip-scale packaging proposed by the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that the drawings are all in a very simplified form and use imprecise ratios, which are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.
[0031] A method for preparing an LED filament with self-adjustable temperature based on chip-scale packaging, comprising the steps of:
[0032] S1: Prepare fluorescent adhesive film 1;
[0033] Preferably, mix silica gel A, B glue with fluorescent powder, and make a fluorescent adhesive film by spin coating or screen printing, with a thickness between 0.2 and 0.6 mm;
[0034] S2: preparing chip-scale...
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The invention discloses a preparation method of a color temperature self-adjustable LED lamp filament based on chip scale packaging. The preparation method comprises the following steps: preparing a fluorescent glue film, preparing chip scale packaging flip chips with different color temperatures, etching a conductive line on a substrate and mounting the chips. The preparation method of the color temperature self-adjustable LED lamp filament, based on chip scale packaging, disclosed by the invention, has the benefits that different luminous flux, color temperature, color rendering index (CRI) and light color requirements can be met, the requirements of a real living environment for luminescence are met, and a user can skillfully couple required lighting effects through regulating and controlling the intensity of current on the line where the chips with the different color temperatures are arranged. Moreover, the use flexibility and the applicable range of the LED lamp filament are also increased, and the suitability for large-scale industrial production is also realized.
Description
technical field [0001] The invention belongs to the lighting technology of LED lamps, and in particular relates to a method for preparing LED filaments with self-adjustable temperature based on chip-level packaging. Background technique [0002] Light Emitting Diode (Light Emitting Diode) light source, as a new type of green lighting source, has been widely used around the world for its characteristics of no pollution, long life, low loss, pure light color, and shock resistance. Chip-scale packaged LEDs have attracted wide attention due to their small package size, good heat dissipation performance, uniform light emission, and long life, and have become the industry's new favorite in recent years due to their high flexibility. [0003] At present, large LED companies in Taiwan, Japan, South Korea, Europe and the United States have released similar chip-scale package LED products. Combining the products of various companies, the common feature is that based on the basis of f...
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IPC IPC(8): H01L25/075
Inventor 邹军姜楠石明明李杨杨波波李文博房永征
Owner NINGBO LONGER LIGHTING