Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Processing method of sheet-type fuse blocking layer

A processing method and barrier layer technology, applied in the manufacture of emergency protective devices, electrical components, fuses, etc., can solve the problems of lower product quality and pass rate, long time-consuming barrier layers, low personnel efficiency, etc., to improve product quality and The pass rate, the property of enhancing the resistance to physical shock, and the effect of increasing the accumulation speed

Active Publication Date: 2017-12-19
CHINA ZHENHUA GRP YUNKE ELECTRONICS
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a processing method for the barrier layer of a chip fuse to solve the problem that the time-consuming printing of the square-shaped barrier layer in the prior art is long, the efficiency of personnel is low, and the small The bumps are likely to cause the breakage of the barrier layer, reducing product quality and pass rate

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Processing method of sheet-type fuse blocking layer
  • Processing method of sheet-type fuse blocking layer
  • Processing method of sheet-type fuse blocking layer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] This embodiment provides a method for processing the barrier layer of a chip fuse, which includes the following steps:

[0037] S1: When printing the barrier layer, the pressure value is 4.0kg / cm 2 , the speed is 60mm / s, the number of turns is 0.1, and the printing is carried out;

[0038] S2: When the thickness of the barrier layer accumulates to 1 / 6 of the total thickness, the pressure value is 1.5kg / cm 2 , the speed is 85mm / s, and the number of turns is 1.2 turns for printing.

[0039] Wipe the screen with a dust-free paper every time the printing of the barrier layer of the chip fuse is completed for 3 pieces.

Embodiment 2

[0041] This embodiment provides a method for processing the barrier layer of a chip fuse, which includes the following steps:

[0042] S1: When printing the barrier layer, the pressure value is 4.2kg / cm 2 , The speed is 65mm / s, the number of turns is 0.2, and the printing is carried out;

[0043] S2: When the thickness of the barrier layer accumulates to 1 / 6 of the total thickness, the pressure value is 2kg / cm 2 , the speed is 90mm / s, and the number of turns is 1.5 turns for printing.

[0044] Wipe the screen with a dust-free paper every time the printing of the barrier layer of the chip fuse is completed for 3 pieces.

Embodiment 3

[0046] This embodiment provides a method for processing the barrier layer of a chip fuse, which includes the following steps:

[0047] S1: When printing the barrier layer, the pressure value is 4.5kg / cm 2 , the speed is 70mm / s, the number of circles is 0.5 circles, and the printing is carried out;

[0048] S2: When the thickness of the barrier layer accumulates to 1 / 6 of the total thickness, the pressure value is 2.5kg / cm 2 , the speed is 95mm / s, and the number of turns is 2 turns for printing.

[0049] Wipe the screen with a dust-free paper every time the printing of the barrier layer of the chip fuse is completed for 3 pieces.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the field of manufacturing of an electronic component, aims to solve the problems that a printed box-shaped blocking layer in the prior art is relatively long in consumed time, low in personnel efficiency and low in product quality and qualified rate and is easy to break, and provides a processing method of a sheet-type fuse blocking layer. According to the processing method of the sheet-type fuse blocking layer, provided by the embodiment of the invention, a method of high pressure, low speed and low turn number is employed, a base of the blocking layer is enabled to be smooth, and accumulation of the subsequent blocking layers is facilitated; and the pressure is reduced, the speed is increased, the turn number is increased for printing, the blocking layer is changed to a rectangular shape which is consistent in upper width and lower width from a trapezoid with a narrow upper part and a wide lower part, the property of physical impact resistance of the blocking layer is improved, and meanwhile, the accumulation speed of the thickness of the blocking layer is increased. With the processing method of the sheet-type fuse blocking layer, provided by the embodiment of the invention, the blocking layer can be effectively prevented from being easily broken, the production cost is reduced, and the product quality and the qualified rate are improved.

Description

technical field [0001] The invention relates to the field of manufacturing electronic components, in particular to a processing method for a barrier layer of a chip fuse. Background technique [0002] CFF / 6025 / F and CFF / 6332 / F chip fuses need to print a square frame barrier layer, and the thickness needs to be accumulated to 500-650μm according to the process requirements. According to the traditional printing method, not only is it time-consuming and the efficiency of personnel is low, but also small bumps when handling the substrate or during the printing process can easily cause the barrier layer to break, reducing product quality and pass rate. Contents of the invention [0003] The purpose of the present invention is to provide a processing method for the barrier layer of a chip fuse to solve the problem that the time-consuming printing of the square-shaped barrier layer in the prior art is long, the efficiency of personnel is low, and the small Any bumps are likely ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01H69/02
CPCH01H69/022
Inventor 肖晴韩玉成李厚忠刘应强彭昌文王成蒲蓉王海珍
Owner CHINA ZHENHUA GRP YUNKE ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com