Encapsulation structure and encapsulation method of biochip

Abstract

The invention discloses a biochip packaging structure and method. The packaging structure comprises a first substrate and a second substrate, a wiring layer located on the side, facing the second substrate, of the first substrate, a biochip located on the side, back on to the first substrate, of the wiring layer, a first hydrophobic layer covering the wiring layer and the biochip, and a second hydrophobic layer located on the side, facing the first substrate, of the second substrate. A detection unit is arranged on the surface of the side, back on to the wiring layer, of the biochip, and the detection unit is exposed out of the first hydrophobic layer. The surface of the side, back on to the wiring layer, of the first hydrophobic layer is flush with the surface of the side, back on to the wiring layer, of the detection unit. A fluid channel is formed between the first hydrophobic layer and the second hydrophobic layer. An electric connection area is arranged on the side, back on to the wiring layer, of the biochip. The electric connection area is electrically connected with the wiring layer through a silicon chip channel. The problems that due to the fact that a chip is supported by cylindrical structures, a fluid channel might be blocked, flow smoothness is poor, a packaging structure is prone to pollution, the recycling rate is low, and miniaturization is not easy are solved.

Description

technical field [0001] The invention relates to the field of packaging technology, in particular to a packaging structure and packaging method for a biochip. Background technique [0002] Based on the principle of specific interaction between biomolecules, the biochip integrates the biochemical analysis process on the surface of the chip, so as to realize the high-throughput and rapid detection of DNA, RNA, peptides, proteins and other biological components. High-throughput rapid detection to obtain disease detection results is now widely used in the field of biomedicine, with the characteristics of high-throughput, automation and miniaturization. [0003] Such as figure 1 As shown, in the currently commonly used biochip packaging structure, there are some columnar structures 02 in the fluid channel 01 to support the biochip, which not only increases the resistance of the fluid flow process in the fluid channel 01, which is not conducive to the smooth flow of the fluid, but...

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Problems solved by technology

[0004] In order to solve the above-mentioned technical problems, the embodiment of the present invention provides a packaging structure and packaging method for biochips to solve the problems of poor flow stability, easy contamination of the packaging structure, and repeated use due to obstacles in the fluid channel introduced by the columnar structure supporting the chip. low efficiency and difficulty in miniaturization, improve the integration of the packaging structure of the biochip, and reduce the cost of the packaging structure

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