Contact analysis method in three-dimensional mechanical finite element model analysis

Abstract

The invention belongs to the technical field of mechanical analysis and numerical solution of a three-dimensional structure and relates to a contact analysis method in three-dimensional mechanical finite element model analysis. The method comprises the steps of firstly modeling a target electron device structure; introducing a displacement boundary condition or a stress boundary condition to establish a corresponding geometric structure model; generating a contact relation between parts according to a mutual relation between the parts; then subdividing the established geometric structure model by use of a tetrahedral mesh; generating a joint surface mesh according to a surface mesh in a simulated area contact surface; and finally establishing a finite element general intrinsic equation of a target electron device in consideration of a contact problem by use of a finite element method, solving the equation to obtain a characteristic value and a characteristic vector, and post-processing to obtain a vibration modal frequency and a vibration model. Therefore, the contact analysis in modal analysis is realized and a high-precision numerical calculation result is obtained.

Description

technical field [0001] The invention belongs to the technical field of three-dimensional structural mechanics analysis numerical solution, and relates to a contact analysis method in three-dimensional mechanics finite element modal analysis. Background technique [0002] The environment in which electronic devices are used is often very harsh, such as vibration during transportation on rough roads, aircraft takeoff, tanks traveling at high speed, gravity acceleration during the ascent phase of satellites and missiles, etc., which impose very strict requirements on the mechanical strength of electronic devices. However, mechanical properties are an important part of the reliability and stability of electronic devices, which directly affects whether the device can work normally. Therefore, it is necessary to optimize the design of the mechanical properties of electronic devices, and modal analysis can obtain the vibration characteristics of electronic devices, which is an impo...

AI Technical Summary

Problems solved by technology

Regarding the analysis of contact problems, a large number of literatures describe a nonlinear analysis process, so for the analysis of contact problems in modal analysis, only some commercial software such as ANSYS software developed by the American ANSYS company can do this. However, the technical content involved has not been released to the public due to commercial confidentiality.

However, due to its wide adaptability, commercial software does not have an advantage in the efficiency of the algorithm. With the complexity of the analysis structure, it cannot meet the accuracy and efficiency requirements of professional users to a certain extent.

Moreover, due to its high degree of encapsulation, the function of contact analysis cannot be used transparently in the secondary development of users, which will also affect the needs of professional users

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