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Poor-backlight PCB reworking technology

A bad, backlight technology, applied in the secondary processing of printed circuits, electrical components, printed circuit manufacturing, etc., can solve the problems of open circuit risk, unsatisfactory backlight effect, etc., achieve excellent penetration effect of potion, and ensure copper surface roughness Effect

Inactive Publication Date: 2017-12-29
奥士康精密电路(惠州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The traditional backlight rework method is to directly deposit copper once without electroplating, and the backlight effect is not ideal when the copper is deposited, and there is a risk of hole opening

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] The present invention will be described in detail below in conjunction with examples, which are only preferred implementations of the present invention, and are not limitations of the present invention.

[0036] A PCB rework process with bad backlight, comprising the following steps:

[0037] (1) Perform the first copper sinking on the PCB with poor backlight;

[0038] (2) Perform the first VCP line electroplating on the PCB with bad backlight;

[0039] (3) Perform the second copper sinking on the PCB with poor backlight;

[0040] (4) Perform the second VCP line electroplating on the PCB with bad backlight;

[0041] Both the first copper sinking and the second copper sinking include the following steps: coarse grinding→expansion→glue removal→tertiary water washing→neutralization→secondary water washing→oil removal→dilute pickling→secondary water washing→micro Etching→pre-soaking→activation→secondary washing→acceleration→first-level washing→copper sinking→secondary wa...

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PUM

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Abstract

The invention provides a poor-backlight PCB reworking technology, and the technology comprises the following steps: (1), carrying out the first electroless plating of copper for a poor-backlight PCB; (2), carrying out the first electroplating for the poor-backlight PCB; (3), carrying out the second electroless plating of copper for the poor-backlight PCB; (4), carrying out the second electroplating for the poor-backlight PCB, and managing and controlling the main control parameters of the above steps, thereby achieving the good backlight effect of the PCB after reworking. Moreover, there is no hole open-circuit risk.

Description

technical field [0001] The invention relates to the field of PCB production technology, in particular to a PCB rework process with bad backlight. Background technique [0002] Copper sinking is an important process link in PCB production, which specifically includes the following steps: coarse grinding→expansion→glue removal→third-stage water washing→neutralization→secondary water washing→degreasing→dilute pickling→secondary water washing→micro-etching→pretreatment Soaking → activation → secondary washing → acceleration → primary washing → copper sinking → secondary washing. [0003] Coarse grinding: the purpose is to remove impurities such as oxidation and oil stains on the surface of the board, and to remove impurities such as resin dust in the holes and resin dust in the holes; expansion: because the base resin is a polymer compound, the intermolecular bonding is very strong The dirty resin is effectively removed, and it is bulked and softened by expansion treatment, so ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/22
CPCH05K3/225H05K2203/0723H05K2203/11
Inventor 李雄仔蒋善刚其他发明人请求不公开姓名
Owner 奥士康精密电路(惠州)有限公司