Fluoroalkyl-containing curable organopolysiloxane composition, cured object obtained therefrom, and electronic component or display device including cured object

Abstract

The invention provides a curable composition attaining a high permittivity and satisfactory transparency; a dielectric layer for display devices which is a cured object obtained from the curable composition; and a display device. The invention further provides a fluoroalkyl-containing curable organopolysiloxane composition that comprises (A) a fluoroalkyl-containing organopolysiloxane which has atleast two alkenyl groups in the molecule and an average degree of polymerization less than 150 and in which at least 10 mol% of all the substituents on the silicon atoms are accounted for by a specific fluoroalkyl group, (B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in the molecule, the amount of the component (B) being such that the amount of the silicon-bonded hydrogen atoms in the component (B) is 0.1-1.0 mol per mol of all the alkenyl groups contained in the component (A), (C) an effective amount of a catalyst for hydrosilylation, and (D) any solventas an optional component; a cured object obtained from the fluoroalkyl-containing curable organopolysiloxane composition; and uses of the cured object.

Description

technical field [0001] The present invention relates to a curable organopolysiloxane composition containing a fluoroalkyl group having a high dielectric constant and good transparency, and its cured product, preferably a film-like or sheet-like dielectric layer for use in electronic materials or Components of a display device, and a display device having these components, preferably a touch panel. Background technique [0002] Polysiloxane-based gel-like materials are widely used as sealing materials for semiconductors due to their excellent electrical insulation, heat resistance, cold resistance and stress relaxation properties, used to protect semiconductors from heat and cold cycles. stress and the effects of external failures such as heat / moisture. Its good stress relaxation properties are due to the low elastic modulus and high compressibility of polysiloxane gel. On the other hand, due to the surface characteristics of the gel-like material, it also has high adhesion...

AI Technical Summary

Problems solved by technology

Since the cured silicone rubber obtained here has high adhesiveness to the substrate, when pressure is applied from a substrate such as glass or plastic, there is the following problem: the relationship between the substrate and the cured silicone rubber The high adhesion between becomes an obstacle, thereby reducing the compressibility

Therefore, for addition-curable fluoroalkyl-containing organopolysiloxanes with excellent transparency, high specific permittivity, and excellent compression / recovery properties, dielectric layer films containing the organosiloxane, and dielectric Display devices composed of thin films have not been reported

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